Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8385084 | Shielding structures for signal paths in electronic devices | Jinbang Tang, Ronald V. McBean | 2013-02-26 |
| 8097494 | Method of making an integrated circuit package with shielding via ring structure | Jinbang Tang, Darrel R. Frear, Marc Alan Mangrum, Robert E. Booth, Lawrence N. Herr +1 more | 2012-01-17 |
| 8004068 | Shielded multi-layer package structures | Jinbang Tang | 2011-08-23 |
| 7869225 | Shielding structures for signal paths in electronic devices | Jinbang Tang, Ronald V. McBean | 2011-01-11 |
| 7651889 | Electromagnetic shield formation for integrated circuit die package | Jinbang Tang, Darrel R. Frear, Marc Alan Mangrum, Robert E. Booth, Lawrence N. Herr +1 more | 2010-01-26 |
| 7648858 | Methods and apparatus for EMI shielding in multi-chip modules | Jinbang Tang | 2010-01-19 |
| 6953985 | Wafer level MEMS packaging | William H. Lytle, Owen R. Fay, Steven Markgraf, Henry G. Hughes, Craig Amrine +1 more | 2005-10-11 |
| 6310403 | Method of manufacturing components and component thereof | Chunsheng Zhang, Scott E. Lindsey, Yifan Guo, Li Li | 2001-10-30 |
| 6022761 | Method for coupling substrates and structure | Melissa Grupen-Shemansky, Theodore G. Tessier | 2000-02-08 |
| 5674780 | Method of forming an electrically conductive polymer bump over an aluminum electrode | William H. Lytle, Treliant Fang, Ravinder K. Sharma, Naresh Saha | 1997-10-07 |
| 5587342 | Method of forming an electrical interconnect | William H. Lytle, Ravichandran Subrahmanyan | 1996-12-24 |
| 5520785 | Method for enhancing aluminum nitride | Keenan L. Evans, Hang M. Liaw | 1996-05-28 |