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Shielding structures for signal paths in electronic devices |
Jinbang Tang, Ronald V. McBean |
2013-02-26 |
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Method of making an integrated circuit package with shielding via ring structure |
Jinbang Tang, Darrel R. Frear, Marc Alan Mangrum, Robert E. Booth, Lawrence N. Herr +1 more |
2012-01-17 |
| 8004068 |
Shielded multi-layer package structures |
Jinbang Tang |
2011-08-23 |
| 7869225 |
Shielding structures for signal paths in electronic devices |
Jinbang Tang, Ronald V. McBean |
2011-01-11 |
| 7651889 |
Electromagnetic shield formation for integrated circuit die package |
Jinbang Tang, Darrel R. Frear, Marc Alan Mangrum, Robert E. Booth, Lawrence N. Herr +1 more |
2010-01-26 |
| 7648858 |
Methods and apparatus for EMI shielding in multi-chip modules |
Jinbang Tang |
2010-01-19 |
| 6953985 |
Wafer level MEMS packaging |
William H. Lytle, Owen R. Fay, Steven Markgraf, Henry G. Hughes, Craig Amrine +1 more |
2005-10-11 |
| 6310403 |
Method of manufacturing components and component thereof |
Chunsheng Zhang, Scott E. Lindsey, Yifan Guo, Li Li |
2001-10-30 |
| 6022761 |
Method for coupling substrates and structure |
Melissa Grupen-Shemansky, Theodore G. Tessier |
2000-02-08 |
| 5674780 |
Method of forming an electrically conductive polymer bump over an aluminum electrode |
William H. Lytle, Treliant Fang, Ravinder K. Sharma, Naresh Saha |
1997-10-07 |
| 5587342 |
Method of forming an electrical interconnect |
William H. Lytle, Ravichandran Subrahmanyan |
1996-12-24 |
| 5520785 |
Method for enhancing aluminum nitride |
Keenan L. Evans, Hang M. Liaw |
1996-05-28 |
