| 7960812 |
Electrical devices having adjustable capacitance |
Jeffery Gilbert |
2011-06-14 |
| 7956451 |
Packages for encapsulated semiconductor devices and method of making same |
Jeffery Gilbert, George Libricz, Ralph Salvatore Moyer |
2011-06-07 |
| 7541669 |
Semiconductor device package with base features to reduce leakage |
Jeffery Gilbert, George Libricz, Ralph Salvatore Moyer, John W. Osenbach, Hugo Safar +1 more |
2009-06-02 |
| 7456716 |
Electrical devices having adjustable electrical characteristics |
Jeffery Gilbert |
2008-11-25 |
| 7314781 |
Device packages having stable wirebonds |
Brett J. Campbell, Jason Goodelle, Michael Quinn |
2008-01-01 |
| 7224047 |
Semiconductor device package with reduced leakage |
Jeffery Gilbert, George Libricz, Ralph Salvatore Moyer, John W. Osenbach, Hugo Safar +1 more |
2007-05-29 |
| 7009305 |
Methods and apparatus for integrated circuit ball bonding using stacked ball bumps |
— |
2006-03-07 |