Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device package with base features to reduce leakage

Semiconductor device package with base features to reduce leakage

US Patent 7541669 · Granted Jun 2, 2009

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Hybrid integrated circuit package2025
Thermal interface material containment2025
Opto-electronic package and a method for making an opto-electronic package2023
Low-cost nano-heat pipe2021
Tunable waveguide devices2020
Photonic integrated circuit package2019
Tunable waveguide devices2019
Tunable waveguide devices2019
Tunable waveguide devices2019
Low-cost nano-heat pipe2019
Tunable waveguide devices2019
Tunable waveguide devices2018