Issued Patents All Time
Showing 51–75 of 135 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6537135 | Curvilinear chemical mechanical planarization device and method | William Easter, John A. Maze, Frank Miceli, Charles Walter Pearce | 2003-03-25 |
| 6532489 | Electronic mail alerting system and method with user options | — | 2003-03-11 |
| 6525358 | Capacitor having the lower electrode for preventing undesired defects at the surface of the metal plug | Edward B. Harris, Yifeng Winston Yan | 2003-02-25 |
| 6524957 | Method of forming in-situ electroplated oxide passivating film for corrosion inhibition | Sudhanshu Misra, Pradip K. Roy | 2003-02-25 |
| 6498364 | Capacitor for integration with copper damascene processes | Stephen W. Downey, Edward B. Harris | 2002-12-24 |
| 6495875 | Method of forming metal oxide metal capacitors using multi-step rapid material thermal process and a device formed thereby | Siddhartha Bhowmik, Pradip K. Roy, Sidhartha Sen | 2002-12-17 |
| 6492712 | High quality oxide for use in integrated circuits | Yuanning Chen, Sundar Srinivasan Chetlur, Pradip K. Roy | 2002-12-10 |
| 6471925 | Method for treating an effluent gas during semiconductor processing | Sudhanshu Misra, Pradip K. Roy | 2002-10-29 |
| 6472304 | Wire bonding to copper | Sailesh Chittipeddi | 2002-10-29 |
| 6458289 | CMP slurry for polishing semiconductor wafers and related methods | Sudhanshu Misra, Pradip K. Roy | 2002-10-01 |
| 6458016 | Polishing fluid, polishing method, semiconductor device and semiconductor device fabrication method | Sudhanshu Misra, Pradip K. Roy, Hem M. Vaidya | 2002-10-01 |
| 6455418 | Barrier for copper metallization | Siddhartha Bhowmik, Sailesh Chittipeddi | 2002-09-24 |
| 6440849 | Microstructure control of copper interconnects | Pradip K. Roy | 2002-08-27 |
| 6440852 | Integrated circuit including passivated copper interconnection lines and associated manufacturing methods | Martin G. Meder, Michael L. Steigerwald, Yiu-Huen Wong | 2002-08-27 |
| 6436830 | CMP system for polishing semiconductor wafers and related method | Sudhanshu Misra, Pradip K. Roy | 2002-08-20 |
| 6410986 | Multi-layered titanium nitride barrier structure | Pradip K. Roy | 2002-06-25 |
| 6410419 | Silicon carbide barrier layers for porous low dielectric constant materials | Sudhanshu Misra, Pradip K. Roy | 2002-06-25 |
| 6403415 | Semiconductor device having a metal barrier layer for a dielectric material having a high dielectric constant and a method of manufacture thereof | Glenn B. Alers, Pradip K. Roy | 2002-06-11 |
| 6375541 | Polishing fluid polishing method semiconductor device and semiconductor device fabrication method | Sudhanshu Misra, Pradip K. Roy, Hem M. Vaidya | 2002-04-23 |
| 6373087 | Methods of fabricating a metal-oxide-metal capacitor and associated apparatuses | Edward B. Harris, Yifeng Winston Yan | 2002-04-16 |
| 6368200 | Polishing pads from closed-cell elastomer foam | Sudhanshu Misra, Pradip K. Roy | 2002-04-09 |
| 6365511 | Tungsten silicide nitride as a barrier for high temperature anneals to improve hot carrier reliability | Isik C. Kizilyalli, Joseph R. Radosevich | 2002-04-02 |
| 6364744 | CMP system and slurry for polishing semiconductor wafers and related method | Sudhanshu Misra, Pradip K. Roy | 2002-04-02 |
| 6365327 | Process for manufacturing in integrated circuit including a dual-damascene structure and an integrated circuit | Sailesh Chittipeddi | 2002-04-02 |
| 6359339 | Multi-layered metal silicide resistor for Si Ic's | Richard W. Gregor, Isik C. Kizilyalli, Jaseph R. Radosevich, Pradip K. Roy | 2002-03-19 |