Issued Patents All Time
Showing 101–125 of 135 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6235594 | Methods of fabricating an integrated circuit device with composite oxide dielectric | Pradip K. Roy | 2001-05-22 |
| 6218255 | Method of making a capacitor | Larry Bruce Fritzinger, Nace Layadi, Pradip K. Roy | 2001-04-17 |
| 6180518 | Method for forming vias in a low dielectric constant material | Nace Layadi, Simon John Molloy, Pradip K. Roy | 2001-01-30 |
| 6169036 | Method for cleaning via openings in integrated circuit manufacturing | Siddhartha Bhowmik, Joseph W. Buckfeller, G. Craig Clabough | 2001-01-02 |
| 6168991 | DRAM capacitor including Cu plug and Ta barrier and method of forming | Seungmoo Choi, Pradip K. Roy | 2001-01-02 |
| 6157082 | Semiconductor device having aluminum contacts or vias and method of manufacture therefor | Binh Nguyenphu | 2000-12-05 |
| 6153452 | Method of manufacturing semiconductor devices having improved polycide integrity through introduction of a silicon layer within the polycide structure | Arun K. Nanda, Pradip K. Roy, Hem M. Vaidya | 2000-11-28 |
| 6147388 | Polycide gate structure with intermediate barrier | Yi Ma, Minseok Oh, Pradip K. Roy | 2000-11-14 |
| 6136159 | Method for depositing metal | Joseph W. Buckfeller, Sailesh Chittipeddi | 2000-10-24 |
| 6130150 | Method of making a semiconductor device with barrier and conductor protection | Sudhanshu Misra, Pradip K. Roy | 2000-10-10 |
| 6119921 | Bonding of aluminum oxide components to silicon substrates | Michael Brady, Mindaugas F. Dautartas, James F. Dormer, Casimir R. Nijander, John W. Osenbach | 2000-09-19 |
| 6114234 | Method of making a semiconductor with copper passivating film | Sudhanshu Misra, Pradip K. Roy | 2000-09-05 |
| 6103586 | Method for making integrated circuit capacitor including anchored plugs | Sundar Srinivasan Chetlur, James T. Clemens, Pradip K. Roy, Hem M. Vaidya | 2000-08-15 |
| 6103607 | Manufacture of MOSFET devices | Isik C. Kizilayalli, Pradip K. Roy | 2000-08-15 |
| 6100587 | Silicon carbide barrier layers for porous low dielectric constant materials | Sudhanshu Misra, Pradip K. Roy | 2000-08-08 |
| 6071808 | Method of passivating copper interconnects in a semiconductor | Sudhanshu Misra, Pradip K. Roy | 2000-06-06 |
| 6034405 | Bonding of aluminum oxide components to silicons substrates | Michael Brady, Mindaugas F. Dautartas, James F. Dormer, Casimir R. Nijander, John W. Osenbach | 2000-03-07 |
| 6028359 | Integrated circuit having amorphous silicide layer in contacts and vias and method of manufacture therefor | Daniel J. Vitkavage, Susan Clay Vitkavage | 2000-02-22 |
| 5994221 | Method of fabricating aluminum-indium (or thallium) vias for ULSI metallization and interconnects | Isik C. Kizilyalli | 1999-11-30 |
| 5981403 | Layered silicon nitride deposition process | Yi Ma, Pradip K. Roy | 1999-11-09 |
| 5972179 | Silicon IC contacts using composite TiN barrier layer | Sailesh Chittipeddi | 1999-10-26 |
| 5935396 | Method for depositing metal | Joseph W. Buckfeller, Sailesh Chittipeddi | 1999-08-10 |
| 5913146 | Semiconductor device having aluminum contacts or vias and method of manufacture therefor | Binh Nguyenphu | 1999-06-15 |
| 5902504 | Systems and methods for determining semiconductor wafer temperature and calibrating a vapor deposition device | Binh Nguyenphu | 1999-05-11 |
| 5858873 | Integrated circuit having amorphous silicide layer in contacts and vias and method of manufacture thereof | Susan Clay Vitkavage, Daniel J. Vitkavage | 1999-01-12 |