Issued Patents All Time
Showing 126–135 of 135 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5846871 | Integrated circuit fabrication | Jean L. Lee, Yi Ma | 1998-12-08 |
| 5807760 | Method of despositing an aluminum-rich layer | Joseph W. Buckfeller, Sailesh Chittipeddi | 1998-09-15 |
| 5798300 | Method for forming conductors in integrated circuits | Sailesh Chittipeddi | 1998-08-25 |
| 5693561 | Method of integrated circuit fabrication including a step of depositing tungsten | Leonard J. Olmer, Ronald J. Schutz | 1997-12-02 |
| 5641994 | Multilayered A1-alloy structure for metal conductors | Cheryl Anne Bollinger, Edward Dein, Arun K. Nanda, Pradip K. Roy, Cletus W. Wilkins, Jr. | 1997-06-24 |
| 5599739 | Barrier layer treatments for tungsten plug | Arun K. Nanda, Pradip K. Roy | 1997-02-04 |
| 5561083 | Method of making multilayered Al-alloy structure for metal conductors | Cheryl Anne Bollinger, Edward Dein, Arun K. Nanda, Pradip K. Roy, Cletus W. Wilkins, Jr. | 1996-10-01 |
| 5523259 | Method of forming metal layers formed as a composite of sub-layers using Ti texture control layer | Arun K. Nanda, Pradip K. Roy | 1996-06-04 |
| 5489552 | Multiple layer tungsten deposition process | Arun K. Nanda, Pradip K. Roy | 1996-02-06 |
| 5461005 | Method of forming silicide in integrated circuit manufacture | Ajit S. Manocha, Ranbir Singh | 1995-10-24 |