Issued Patents All Time
Showing 76–100 of 135 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6358790 | Method of making a capacitor | Larry Bruce Fritzinger, Nace Layadi, Pradip K. Roy | 2002-03-19 |
| 6355184 | Method of eliminating agglomerate particles in a polishing slurry | Annette M. Crevasse, William Easter, John A. Maze, Frank Miceli | 2002-03-12 |
| 6348393 | Capacitor in an integrated circuit and a method of manufacturing an integrated circuit | Sailesh Chittipeddi | 2002-02-19 |
| 6340827 | Diffusion barrier for use with high dielectric constant materials and electronic devices incorporating same | Seungmoo Choi, Pradip K. Roy | 2002-01-22 |
| 6339246 | Tungsten silicide nitride as an electrode for tantalum pentoxide devices | Isik C. Kizilyalli, Pradip K. Roy | 2002-01-15 |
| 6335557 | Metal silicide as a barrier for MOM capacitors in CMOS technologies | Isik C. Kizilyalli, Joseph R. Radosevich | 2002-01-01 |
| 6331460 | Method of fabricating a mom capacitor having a metal silicide barrier | Isik C. Kizilyalli, Joseph R. Radosevich | 2001-12-18 |
| 6331484 | Titanium-tantalum barrier layer film and method for forming the same | Siddhartha Bhowmik, Minseok Oh, Pradip K. Roy, Sidhartha Sen | 2001-12-18 |
| 6323044 | Method of forming capacitor having the lower metal electrode for preventing undesired defects at the surface of the metal plug | Edward B. Harris, Yifeng Winston Yan | 2001-11-27 |
| 6323537 | Capacitor for an integrated circuit | Larry Bruce Fritzinger, Nace Layadi, Pradip K. Roy | 2001-11-27 |
| 6323078 | Method of forming metal oxide metal capacitors using multi-step rapid thermal process and a device formed thereby | Siddhartha Bhowmik, Pradip K. Roy, Sidhartha Sen | 2001-11-27 |
| 6319095 | Colloidal suspension of abrasive particles containing magnesium as CMP slurry | Sudhanshu Misra, Pradip K. Roy | 2001-11-20 |
| 6320244 | Integrated circuit device having dual damascene capacitor | Glenn B. Alers, Seungmoo Choi, Pradip K. Roy | 2001-11-20 |
| 6320238 | Gate structure for integrated circuit fabrication | Isik C. Kizilyalli, Yi Ma, Pradip K. Roy | 2001-11-20 |
| 6319837 | Technique for reducing dishing in Cu-based interconnects | Sailesh Chittipeddi, Pradip K. Roy | 2001-11-20 |
| 6313025 | Process for manufacturing an integrated circuit including a dual-damascene structure and an integrated circuit | Sailesh Chittipeddi | 2001-11-06 |
| 6313021 | PMOS device having a layered silicon gate for improved silicide integrity and enhanced boron penetration resistance | Joseph R. Radosevich, Pradip K. Roy | 2001-11-06 |
| 6294468 | Method of chemical vapor depositing tungsten films | Adrienne Gould-Choquette | 2001-09-25 |
| 6291848 | Integrated circuit capacitor including anchored plugs | Sundar Srinivasan Chetlur, James T. Clemens, Pradip K. Roy, Hem M. Vaidya | 2001-09-18 |
| 6288449 | Barrier for copper metallization | Siddhartha Bhowmik, Sailesh Chittipeddi | 2001-09-11 |
| 6287970 | Method of making a semiconductor with copper passivating film | Sudhanshu Misra, William M. Moller, Pradip K. Roy | 2001-09-11 |
| 6281110 | Method for making an integrated circuit including deutrium annealing of metal interconnect layers | Isik C. Kizilyalli, Pradip K. Roy | 2001-08-28 |
| 6281129 | Corrosion-resistant polishing pad conditioner | William Easter, John A. Maze | 2001-08-28 |
| 6264536 | Reducing polish platen corrosion during integrated circuit fabrication | Annette M. Crevasse, William Easter, John A. Maze, Frank Miceli | 2001-07-24 |
| 6255688 | Capacitor having aluminum alloy bottom plate | Kuo-Hua Lee | 2001-07-03 |