Issued Patents All Time
Showing 1–25 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11545365 | Chemical planarization | Suryadevara V. Babu | 2023-01-03 |
| 10220487 | Customized polishing pads for CMP and methods of fabrication and use thereof | Pradip K. Roy, Manish Deopura | 2019-03-05 |
| 9375823 | Grooved CMP pads | Robert Kerprich, Karey Holland, Diane Scott | 2016-06-28 |
| 9278424 | Customized polishing pads for CMP and methods of fabrication and use thereof | Pradip K. Roy, Manish Deopura | 2016-03-08 |
| 9272388 | Polishing systems | — | 2016-03-01 |
| 9180570 | Grooved CMP pad | Robert Kerprich, Karey Holland, Diane Scott | 2015-11-10 |
| 8864859 | Customized polishing pads for CMP and methods of fabrication and use thereof | Pradip K. Roy, Manish Deopura | 2014-10-21 |
| 8715035 | Customized polishing pads for CMP and methods of fabrication and use thereof | Pradip K. Roy, Manish Deopura | 2014-05-06 |
| 8383003 | Polishing systems | — | 2013-02-26 |
| 8380339 | Customized polish pads for chemical mechanical planarization | Pradip K. Roy | 2013-02-19 |
| 7704122 | Customized polish pads for chemical mechanical planarization | Pradip K. Roy | 2010-04-27 |
| 7704125 | Customized polishing pads for CMP and methods of fabrication and use thereof | Pradip K. Roy, Manish Deopura | 2010-04-27 |
| 7425172 | Customized polish pads for chemical mechanical planarization | Pradip K. Roy | 2008-09-16 |
| 6683382 | Semiconductor device having an interconnect layer with a plurality of layout regions having substantially uniform densities of active interconnects and dummy fills | Donald Thomas Cwynar, Dennis Okumu Ouma, Vivek Saxena, John Sharpe | 2004-01-27 |
| 6659846 | Pad for chemical mechanical polishing | Pradip K. Roy | 2003-12-09 |
| 6616965 | Non-hydrolytic-sol-gel process for high K dielectric | Pradip K. Roy | 2003-09-09 |
| 6599837 | Chemical mechanical polishing composition and method of polishing metal layers using same | Sailesh Mansinh Merchant, Pradip K. Roy | 2003-07-29 |
| 6596639 | Method for chemical/mechanical planarization of a semiconductor wafer having dissimilar metal pattern densities | William Easter, Vivek Saxena | 2003-07-22 |
| 6544107 | Composite polishing pads for chemical-mechanical polishing | Pradip K. Roy | 2003-04-08 |
| 6540974 | Process for making mixed metal oxides | Pradip K. Roy | 2003-04-01 |
| 6524957 | Method of forming in-situ electroplated oxide passivating film for corrosion inhibition | Sailesh Mansinh Merchant, Pradip K. Roy | 2003-02-25 |
| 6471925 | Method for treating an effluent gas during semiconductor processing | Sailesh Mansinh Merchant, Pradip K. Roy | 2002-10-29 |
| 6461225 | Local area alloying for preventing dishing of copper during chemical-mechanical polishing (CMP) | Pradip K. Roy | 2002-10-08 |
| 6458289 | CMP slurry for polishing semiconductor wafers and related methods | Sailesh Mansinh Merchant, Pradip K. Roy | 2002-10-01 |
| 6458016 | Polishing fluid, polishing method, semiconductor device and semiconductor device fabrication method | Sailesh Mansinh Merchant, Pradip K. Roy, Hem M. Vaidya | 2002-10-01 |