Issued Patents All Time
Showing 26–50 of 135 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7135733 | Capacitor for integration with copper damascene processes and a method of manufacture therefore | Stephen W. Downey, Edward B. Harris | 2006-11-14 |
| 7115985 | Reinforced bond pad for a semiconductor device | Joze E. Antol, Philip William Seitzer, Daniel Chesire, Rafe Carl Mengel, Vance D. Archer, III +2 more | 2006-10-03 |
| 7071563 | Barrier layer for interconnect structures of a semiconductor wafer and method for depositing the barrier layer | Siddhartha Bhowmik, Darrell Simpson | 2006-07-04 |
| 7068139 | Inductor formed in an integrated circuit | Edward B. Harris, Kurt G. Steiner, Susan Clay Vitkavage | 2006-06-27 |
| 7061264 | Test semiconductor device and method for determining Joule heating effects in such a device | Seung H. Kang, Subramanian Karthikeyan | 2006-06-13 |
| 7005375 | Method to avoid copper contamination of a via or dual damascene structure | Subramanian Karthikeyan | 2006-02-28 |
| 6982226 | Method of fabricating a contact with a post contact plug anneal | Binh Nguyenphu, Minseok Oh | 2006-01-03 |
| 6960836 | Reinforced bond pad | Mark A. Bachman, Daniel Chesire, John W. Osenbach, Kurt G. Steiner | 2005-11-01 |
| 6890827 | Method of fabricating a silicon on insulator transistor structure for imbedded DRAM | Seungmoo Choi, Pradip K. Roy | 2005-05-10 |
| 6869873 | Copper silicide passivation for improved reliability | Robert W. Bradshaw, Daniele Gilkes, Deepak A. Ramappa, Kurt G. Steiner | 2005-03-22 |
| 6790757 | Wire bonding method for copper interconnects in semiconductor devices | Sailesh Chittipeddi | 2004-09-14 |
| 6784478 | Junction capacitor structure and fabrication method therefor in a dual damascene process | Yifeng Winston Yan | 2004-08-31 |
| 6750145 | Method of eliminating agglomerate particles in a polishing slurry | Annette M. Crevasse, William Easter, John A. Maze, Frank Miceli | 2004-06-15 |
| 6730601 | Methods for fabricating a metal-oxide-metal capacitor | Edward B. Harris, Yifeng Winston Yan | 2004-05-04 |
| 6730600 | Method of dry etching a semiconductor device in the absence of a plasma | Nace Layadi, Simon John Molloy, Isik C. Kizilyalli | 2004-05-04 |
| 6727588 | Diffusion preventing barrier layer in integrated circuit inter-metal layer dielectrics | Mahjoub Ali Abdelgadir, Nace Layadi, Vivek Saxena, Pei H. Yih | 2004-04-27 |
| 6720604 | Capacitor for an integrated circuit | Larry Bruce Fritzinger, Nace Layadi, Pradip K. Roy | 2004-04-13 |
| 6720261 | Method and system for eliminating extrusions in semiconductor vias | Steven M. Anderson, Siddhartha Bhowmik, Joseph W. Buckfeller, Frank Minardi | 2004-04-13 |
| 6703712 | Microelectronic device layer deposited with multiple electrolytes | Daniele Gilkes, Minseok Oh | 2004-03-09 |
| 6699372 | Method of coil preparation for ionized metal plasma process and method of manufacturing integrated circuits | Siddhartha Bhowmik, Frank Minardi | 2004-03-02 |
| 6686662 | Semiconductor device barrier layer | Isaiah O. Oladeji, Seong Jin Koh | 2004-02-03 |
| 6599837 | Chemical mechanical polishing composition and method of polishing metal layers using same | Sudhanshu Misra, Pradip K. Roy | 2003-07-29 |
| 6585830 | Method for cleaning tungsten from deposition wall chambers | Nace Layadi, Simon John Molloy | 2003-07-01 |
| 6573183 | Method and apparatus for controlling contamination during the electroplating deposition of metals onto a semiconductor wafer surface | Minseok Oh, Deepak A. Ramappa | 2003-06-03 |
| 6541394 | Method of making a graded grown, high quality oxide layer for a semiconductor device | Yuanning Chen, Pradip K. Roy | 2003-04-01 |