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Packaging method involving rearrangement of dice |
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Manjula Variyam |
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2008-07-01 |
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Charles Odegard, Vinu Yamunan |
2008-01-29 |
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Raised solder-mask-defined (SMD) solder ball pads for a laminate electronic circuit board |
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2007-11-13 |
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Darvin R. Edwards, Kejun Zeng |
2007-09-11 |
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Arrangement in semiconductor packages for inhibiting adhesion of lid to substrate while providing compression support |
Rajiv Dunne |
2006-10-24 |
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Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices |
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— |
2005-03-01 |
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Composite lid for land grid array (LGA) flip-chip package assembly |
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2004-08-31 |
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