Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7445960 | Adhesion by plasma conditioning of semiconductor chip | Marvin W. Cowens, Masood Murtuza, Charles Odegard, Phillip R. Coffman | 2008-11-04 |
| 7323362 | Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices | Charles Odegard, Tz-Cheng Chiu | 2008-01-29 |
| 7319275 | Adhesion by plasma conditioning of semiconductor chip | Marvin W. Cowens, Masood Murtuza, Charles Odegard, Phillip R. Coffman | 2008-01-15 |
| 7276401 | Adhesion by plasma conditioning of semiconductor chip surfaces | Marvin W. Cowens, Masood Murtuza, Charles Odegard, Phillip R. Coffman | 2007-10-02 |
| 7271494 | Adhesion by plasma conditioning of semiconductor chip surfaces | Marvin W. Cowens, Masood Murtuza, Charles Odegard, Phillip R. Coffman | 2007-09-18 |
| 6977429 | Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices | Charles Odegard, Tz-Cheng Chiu | 2005-12-20 |
| 6917098 | Three-level leadframe for no-lead packages | — | 2005-07-12 |
| 6869831 | Adhesion by plasma conditioning of semiconductor chip surfaces | Marvin W. Cowens, Masood Murtuza, Charles Odegard, Phillip R. Coffman | 2005-03-22 |