| D637519 |
Non-metallic buckle |
— |
2011-05-10 |
| 7445960 |
Adhesion by plasma conditioning of semiconductor chip |
Marvin W. Cowens, Masood Murtuza, Vinu Yamunan, Charles Odegard |
2008-11-04 |
| 7319275 |
Adhesion by plasma conditioning of semiconductor chip |
Marvin W. Cowens, Masood Murtuza, Vinu Yamunan, Charles Odegard |
2008-01-15 |
| 7276401 |
Adhesion by plasma conditioning of semiconductor chip surfaces |
Marvin W. Cowens, Masood Murtuza, Vinu Yamunan, Charles Odegard |
2007-10-02 |
| 7271494 |
Adhesion by plasma conditioning of semiconductor chip surfaces |
Marvin W. Cowens, Masood Murtuza, Vinu Yamunan, Charles Odegard |
2007-09-18 |
| 6869831 |
Adhesion by plasma conditioning of semiconductor chip surfaces |
Marvin W. Cowens, Masood Murtuza, Vinu Yamunan, Charles Odegard |
2005-03-22 |
| 6514881 |
Hybrid porous low-K dielectrics for integrated circuits |
— |
2003-02-04 |
| 6315397 |
In-situ fluid jet orifice |
Martha A. Truninger, Charles C. Haluzak, John Whitlock, Douglas A. Sexton |
2001-11-13 |
| 6204182 |
In-situ fluid jet orifice |
Martha A. Truninger, Charles C. Haluzak, John Whitlock, Douglas A. Sexton |
2001-03-20 |