Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9646950 | Corrosion-resistant copper bonds to aluminum | Amit Sureshkumar Nangia | 2017-05-09 |
| 7939939 | Stable gold bump solder connections | Wei Qun Peng, Rebecca L. Holford, Robert John Furtaw, Bernardo Gallegos | 2011-05-10 |
| 7291549 | Method and structure to reduce risk of gold embrittlement in solder joints | — | 2007-11-06 |
| 7267861 | Solder joints for copper metallization having reduced interfacial voids | Darvin R. Edwards, Tz-Cheng Chiu | 2007-09-11 |
| 7070088 | Method of semiconductor device assembly including fatigue-resistant ternary solder alloy | — | 2006-07-04 |
| 7005745 | Method and structure to reduce risk of gold embrittlement in solder joints | — | 2006-02-28 |
| 6867503 | Controlling interdiffusion rates in metal interconnection structures | — | 2005-03-15 |