Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7939939 | Stable gold bump solder connections | Kejun Zeng, Wei Qun Peng, Rebecca L. Holford, Bernardo Gallegos | 2011-05-10 |
| 7183657 | Semiconductor device having resin anti-bleed feature | John H. Abbott, Emily Ellen Hoffman | 2007-02-27 |