Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12293948 | Flip chip semiconductor device package with mold compound seal | Gregory Thomas Ostrowicki | 2025-05-06 |
| 12119280 | Semiconductor device package with reduced stress | Gregory Thomas Ostrowicki | 2024-10-15 |
| 12068261 | Strain-induced shift mitigation in semiconductor packages | Gregory Thomas Ostrowicki | 2024-08-20 |
| 11869820 | IC having a metal ring thereon for stress reduction | Sreenivasan K. Koduri, Siva Prakash Gurrum, Christopher Daniel Manack | 2024-01-09 |
| 11430747 | Strain-induced shift mitigation in semiconductor packages | Gregory Thomas Ostrowicki | 2022-08-30 |
| 11387155 | IC having a metal ring thereon for stress reduction | Sreenivasan K. Koduri, Siva Prakash Gurrum, Christopher Daniel Manack | 2022-07-12 |
| 11139178 | Semiconductor package with filler particles in a mold compound | Siva Prakash Gurrum, Janakiraman Seetharaman | 2021-10-05 |
| 11121049 | Semiconductor package with a wire bond mesh | Siva Prakash Gurrum | 2021-09-14 |
| 10446414 | Semiconductor package with filler particles in a mold compound | Siva Prakash Gurrum, Janakiraman Seetharaman | 2019-10-15 |
| 10204842 | Semiconductor package with a wire bond mesh | Siva Prakash Gurrum | 2019-02-12 |
| 9646950 | Corrosion-resistant copper bonds to aluminum | Kejun Zeng | 2017-05-09 |
| 6383873 | Process for forming a structure | Rama I. Hegde, Philip J. Tobin | 2002-05-07 |