Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12293948 | Flip chip semiconductor device package with mold compound seal | Amit Sureshkumar Nangia | 2025-05-06 |
| 12119280 | Semiconductor device package with reduced stress | Amit Sureshkumar Nangia | 2024-10-15 |
| 12068261 | Strain-induced shift mitigation in semiconductor packages | Amit Sureshkumar Nangia | 2024-08-20 |
| 11430747 | Strain-induced shift mitigation in semiconductor packages | Amit Sureshkumar Nangia | 2022-08-30 |
| 9812384 | Semiconductor device having compliant and crack-arresting interconnect structure | — | 2017-11-07 |
| 9496208 | Semiconductor device having compliant and crack-arresting interconnect structure | — | 2016-11-15 |