Issued Patents All Time
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412800 | Integrated circuit package having enhanced thermal dissipation structure | Manu J. Prakuzhy, Blake Travis | 2025-09-09 |
| 12159808 | Wire bond damage detector including a detection bond pad over a first and a second connected structures | Hung-Yun Lin | 2024-12-03 |
| 11869820 | IC having a metal ring thereon for stress reduction | Amit Sureshkumar Nangia, Sreenivasan K. Koduri, Christopher Daniel Manack | 2024-01-09 |
| 11538742 | Packaged multichip module with conductive connectors | Manu J. Prakuzhy, Saumya Gandhi | 2022-12-27 |
| 11521904 | Wire bond damage detector including a detection bond pad over a first and a second connected structures | Hung-Yun Lin | 2022-12-06 |
| 11430719 | Spot-solderable leads for semiconductor device packages | Manu A. Prakuzhy, Daryl R. Heussner, Stefan Wlodzimierz Wiktor, Ken Pham | 2022-08-30 |
| 11387155 | IC having a metal ring thereon for stress reduction | Amit Sureshkumar Nangia, Sreenivasan K. Koduri, Christopher Daniel Manack | 2022-07-12 |
| 11139178 | Semiconductor package with filler particles in a mold compound | Amit Sureshkumar Nangia, Janakiraman Seetharaman | 2021-10-05 |
| 11121049 | Semiconductor package with a wire bond mesh | Amit Sureshkumar Nangia | 2021-09-14 |
| 10622290 | Packaged multichip module with conductive connectors | Manu J. Prakuzhy, Saumya Gandhi | 2020-04-14 |
| 10607927 | Spot-solderable leads for semiconductor device packages | Manu J. Prakuzhy, Daryl R. Heussner, Stefan Wlodzimierz Wiktor, Ken Pham | 2020-03-31 |
| 10497643 | Patterned die pad for packaged vertical semiconductor devices | Manu J. Prakuzhy | 2019-12-03 |
| 10446414 | Semiconductor package with filler particles in a mold compound | Amit Sureshkumar Nangia, Janakiraman Seetharaman | 2019-10-15 |
| 10204842 | Semiconductor package with a wire bond mesh | Amit Sureshkumar Nangia | 2019-02-12 |
| 9373572 | Semiconductor package having etched foil capacitor integrated into leadframe | Gregory E. Howard, Bernardo Gallegos, Rajiv Dunne, Darvin R. Edwards, Manu J. Prakuzhy +1 more | 2016-06-21 |
| 9165873 | Semiconductor package having etched foil capacitor integrated into leadframe | Gregory E. Howard, Bernardo Gallegos, Rajiv Dunne, Darvin R. Edwards, Manu J. Prakuzhy +1 more | 2015-10-20 |
| 9157938 | On-time based peak current density rule and design method | Young-Joon Park | 2015-10-13 |
| 9142496 | Semiconductor package having etched foil capacitor integrated into leadframe | Gregory E. Howard, Bernardo Gallegos, Rajiv Dunne, Darvin R. Edwards, Manu J. Prakuzhy +1 more | 2015-09-22 |
| 9030216 | Coaxial four-point probe for low resistance measurements | Michael A. Lamson, Rajiv Dunne | 2015-05-12 |
| 8716068 | Method for contacting agglomerate terminals of semiconductor packages | Darvin R. Edwards, Masood Murtuza, Matthew David Romig, Kazunori Hayata | 2014-05-06 |
| 8643165 | Semiconductor device having agglomerate terminals | Darvin R. Edwards, Masood Murtuza, Matthew David Romig, Kazunori Hayata | 2014-02-04 |
| 8304897 | Thermal interface material design for enhanced thermal performance and improved package structural integrity | Paul J. Hundt, Vikas Gupta | 2012-11-06 |
| 8174276 | Coaxial four-point probe for low resistance measurements | Michael A. Lamson, Rajiv Dunne | 2012-05-08 |
| 8129224 | Stud bumps as local heat sinks during transient power operations | Kapil Heramb Sahasrabudhe, Vikas Gupta | 2012-03-06 |
| 7989949 | Heat extraction from packaged semiconductor chips, scalable with chip area | Vikas Gupta, Gregory E. Howard | 2011-08-02 |