Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8154109 | Leadframe having delamination resistant die pad | Steven Kummerl | 2012-04-10 |
| 8129224 | Stud bumps as local heat sinks during transient power operations | Siva Prakash Gurrum, Vikas Gupta | 2012-03-06 |
| 8102038 | Semiconductor chip attach configuration having improved thermal characteristics | Jayprakash Chipalkatti | 2012-01-24 |
| 7838988 | Stud bumps as local heat sinks during transient power operations | Siva Prakash Gurrum, Vikas Gupta | 2010-11-23 |
| 7821113 | Leadframe having delamination resistant die pad | Steven Kummerl | 2010-10-26 |