Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412800 | Integrated circuit package having enhanced thermal dissipation structure | Siva Prakash Gurrum, Blake Travis | 2025-09-09 |
| 11901271 | High current packages with reduced solder layer count | Yiqi Tang, Liang Wan, William Todd Harrison, Rajen Manicon Murugan | 2024-02-13 |
| 11545420 | High current packages with reduced solder layer count | Yiqi Tang, Liang Wan, William Todd Harrison, Rajen Manicon Murugan | 2023-01-03 |
| 11538742 | Packaged multichip module with conductive connectors | Siva Prakash Gurrum, Saumya Gandhi | 2022-12-27 |
| 10622290 | Packaged multichip module with conductive connectors | Siva Prakash Gurrum, Saumya Gandhi | 2020-04-14 |
| 10607927 | Spot-solderable leads for semiconductor device packages | Siva Prakash Gurrum, Daryl R. Heussner, Stefan Wlodzimierz Wiktor, Ken Pham | 2020-03-31 |
| 10497643 | Patterned die pad for packaged vertical semiconductor devices | Siva Prakash Gurrum | 2019-12-03 |
| 9373572 | Semiconductor package having etched foil capacitor integrated into leadframe | Gregory E. Howard, Bernardo Gallegos, Rajiv Dunne, Darvin R. Edwards, Siva Prakash Gurrum +1 more | 2016-06-21 |
| 9165873 | Semiconductor package having etched foil capacitor integrated into leadframe | Gregory E. Howard, Bernardo Gallegos, Rajiv Dunne, Darvin R. Edwards, Siva Prakash Gurrum +1 more | 2015-10-20 |
| 9142496 | Semiconductor package having etched foil capacitor integrated into leadframe | Gregory E. Howard, Bernardo Gallegos, Rajiv Dunne, Darvin R. Edwards, Siva Prakash Gurrum +1 more | 2015-09-22 |