| 9373572 |
Semiconductor package having etched foil capacitor integrated into leadframe |
Gregory E. Howard, Bernardo Gallegos, Darvin R. Edwards, Siva Prakash Gurrum, Manu J. Prakuzhy +1 more |
2016-06-21 |
| 9165873 |
Semiconductor package having etched foil capacitor integrated into leadframe |
Gregory E. Howard, Bernardo Gallegos, Darvin R. Edwards, Siva Prakash Gurrum, Manu J. Prakuzhy +1 more |
2015-10-20 |
| 9142496 |
Semiconductor package having etched foil capacitor integrated into leadframe |
Gregory E. Howard, Bernardo Gallegos, Darvin R. Edwards, Siva Prakash Gurrum, Manu J. Prakuzhy +1 more |
2015-09-22 |
| 9030216 |
Coaxial four-point probe for low resistance measurements |
Michael A. Lamson, Siva Prakash Gurrum |
2015-05-12 |
| 8883567 |
Process of making a stacked semiconductor package having a clip |
Michael Todd Wyant, Patricia Sabran Conde, Vikas Gupta, Emerson Mamaril Enipin |
2014-11-11 |
| 8436475 |
IC device having low resistance TSV comprising ground connection |
Gary P. Morrison, Satyendra Singh Chauhan, Masood Murtuza, Thomas D. Bonifield |
2013-05-07 |
| 8431481 |
IC device having low resistance TSV comprising ground connection |
Gary P. Morrison, Satyendra Singh Chauhan, Masood Murtuza, Thomas D. Bonifield |
2013-04-30 |
| 8313982 |
Stacked die assemblies including TSV die |
Margaret Simmons-Matthews |
2012-11-20 |
| 8178976 |
IC device having low resistance TSV comprising ground connection |
Gary P. Morrison, Satyendra Singh Chauhan, Masood Murtuza, Thomas D. Bonifield |
2012-05-15 |
| 8174276 |
Coaxial four-point probe for low resistance measurements |
Michael A. Lamson, Siva Prakash Gurrum |
2012-05-08 |
| 8154134 |
Packaged electronic devices with face-up die having TSV connection to leads and die pad |
Thomas D. Bonifield, Gary P. Morrison, Satyendra Singh Chauhan, Masood Murtuza |
2012-04-10 |
| 8017439 |
Dual carrier for joining IC die or wafers to TSV wafers |
Yoshimi Takahashi, Masood Murtuza, Satyendra Singh Chauhan |
2011-09-13 |
| 7915080 |
Bonding IC die to TSV wafers |
Yoshimi Takahashi, Masood Murtuza, Satyendra Singh Chauhan |
2011-03-29 |
| 7898069 |
Stacked flip-assembled semiconductor chips embedded in thin hybrid substrate |
— |
2011-03-01 |
| 7790597 |
Solder cap application process on copper bump using solder powder film |
Satyendra Singh Chauhan, Gary P. Morrison, Masood Murtuza |
2010-09-07 |
| 7572677 |
Arrangement in semiconductor packages for inhibiting adhesion of lid to substrate while providing compression support |
Tz-Cheng Chiu |
2009-08-11 |
| 7504283 |
Stacked-flip-assembled semiconductor chips embedded in thin hybrid substrate |
— |
2009-03-17 |
| 7126217 |
Arrangement in semiconductor packages for inhibiting adhesion of lid to substrate while providing compression support |
Tz-Cheng Chiu |
2006-10-24 |