Issued Patents All Time
Showing 1–25 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9518587 | Air compressor | Tomoyoshi Yokota, Seiichi Kodato, Hiroki Kitagawa, Kenichi Matsunaga, Masahiro Miura | 2016-12-13 |
| 9082545 | Antenna device and communication device | Satoru Sugita, Toshiaki Yokota, Katsuhisa Orihara | 2015-07-14 |
| 8974191 | Air compressor | Masahiro Miura, Seiichi Kodato, Hiroki Kitagawa, Tomoyoshi Yokota, Kenichi Matsunaga | 2015-03-10 |
| 8622788 | Dust collecting cover | Naoya Eto | 2014-01-07 |
| 8470641 | Exposed mold | — | 2013-06-25 |
| 8410989 | Antenna structure including radiating conductor and magnetic material having dielectric property | Masatoshi Hayakawa, Kiyotada Yokogi, Kenji Asakura, Shuichi Goto | 2013-04-02 |
| 8304883 | Semiconductor device having multiple semiconductor elements | Masazumi Amagai | 2012-11-06 |
| 8278142 | Combined metallic bonding and molding for electronic assemblies including void-reduced underfill | — | 2012-10-02 |
| 8193644 | Pop precursor with interposer for top package bond pad pitch compensation | — | 2012-06-05 |
| 8048358 | Pop semiconductor device manufacturing method | Kiyoharu Takano, Makoto Yoshino | 2011-11-01 |
| 8034660 | PoP precursor with interposer for top package bond pad pitch compensation | — | 2011-10-11 |
| 8017439 | Dual carrier for joining IC die or wafers to TSV wafers | Masood Murtuza, Rajiv Dunne, Satyendra Singh Chauhan | 2011-09-13 |
| 7971351 | Method of manufacturing a semiconductor device | Masazumi Amagai | 2011-07-05 |
| 7915080 | Bonding IC die to TSV wafers | Masood Murtuza, Rajiv Dunne, Satyendra Singh Chauhan | 2011-03-29 |
| 7789466 | Chair-type massage machine | Yuki Yoda, Koji Terada, Shinji Tsutsui, Nobuyuki Nishitani, Taichi Hamatsuka | 2010-09-07 |
| 7632945 | Cyanine dye | Akira Shinpo, Kentaro Yano, Yasushi Aizawa | 2009-12-15 |
| 7629696 | Plastic semiconductor package having improved control of dimensions | — | 2009-12-08 |
| 7520052 | Method of manufacturing a semiconductor device | Masazumi Amagai | 2009-04-21 |
| 7189601 | System and method for forming mold caps over integrated circuit devices | — | 2007-03-13 |
| 7147447 | Plastic semiconductor package having improved control of dimensions | — | 2006-12-12 |
| 7009819 | Magnetic reproducing head having a structure to inhibit electrostatic discharge damage to a recording tape | Yutaka Soda, Susumu Sato, Seiji Onoe | 2006-03-07 |
| 6985336 | Magnetic reproducing head having a structure to inhibit electrostatic discharge to a recording tape | Yutaka Soda, Susumu Sato, Seiji Onoe | 2006-01-10 |
| 5838721 | Spread spectrum communication equipment | Kising Chau | 1998-11-17 |
| 5671248 | Spread spectrum communication equipment | Kising Chau | 1997-09-23 |
| 5663981 | Radio communication apparatus | — | 1997-09-02 |