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Michael A. Lamson — 29 Patents

TITexas Instruments: 29 patents #350 of 12,488Top 3%

Hitachi: 4 patents #8,948 of 28,497Top 35%

Howe, TX: #3 of 59 inventorsTop 6%

Texas: #4,128 of 125,132 inventorsTop 4%

Overall (All Time): #127,851 of 4,157,543Top 4%

29 Patents All Time

Michael A. Lamson has been granted 29 US patents while listed as an inventor at Texas Instruments. The first was granted in 1992 and the most recent in May 2015. Michael A. Lamson ranks #127,851 of 4,157,543 US inventors in our database (top 3.1%). Patent records list Michael A. Lamson in Howe, TX, US.

Patents per Year

Issued Patents All Time

Showing 1–25 of 29 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
9030216	Coaxial four-point probe for low resistance measurements	Siva Prakash Gurrum, Rajiv Dunne	2015-05-12	$16,122,000
8174276	Coaxial four-point probe for low resistance measurements	Siva Prakash Gurrum, Rajiv Dunne	2012-05-08	$5,836,000
7795072	Structure and method of high performance two layer ball grid array substrate	Navinchandra Kalidas	2010-09-14	$5,425,000
7265443	Wire bonded semiconductor device having low inductance and noise	Howard R. Test	2007-09-04	$20,738,000
7195954	Low capacitance coupling wire bonded semiconductor device	Homer B. Klonis	2007-03-27	$8,939,000
7132845	FA tool using conductor model	Jay Michael Lawyer, Roger J. Stierman	2006-11-07	$10,076,000
7132740	Semiconductor package with conductor impedance selected during assembly	Heping Yue	2006-11-07	$10,076,000
6995037	Structure and method of high performance two layer ball grid array substrate	Navinchandra Kalidas	2006-02-07	$11,781,000
6822340	Low capacitance coupling wire bonded semiconductor device	Homer B. Klonis	2004-11-23	$18,745,000
6820046	System for electrically modeling an electronic structure and method of operation	Subhendu Kundu, Ramani Ramesh	2004-11-16	$16,717,000
6794743	Structure and method of high performance two layer ball grid array substrate	Navinchandra Kalidas	2004-09-21	$15,953,000
6563208	Semiconductor package with conductor impedance selected during assembly	Heping Yue	2003-05-13	$21,585,000
6518663	Constant impedance routing for high performance integrated circuit packaging	Richard D. James	2003-02-11	$26,368,000
6424027	Low pass filter integral with semiconductor package	Heping Yue, Truong Ho	2002-07-23	$26,143,000
6323116	Differential pair geometry for integrated circuit chip packages	—	2001-11-27	$57,394,000
6084777	Ball grid array package	Navinchandra Kalidas, Nozar Hassanzadeh	2000-07-04
6064576	Interposer having a cantilevered ball connection and being electrically connected to a printed circuit board	Darvin R. Edwards	2000-05-16	$60,212,000
6054758	Differential pair geometry for integrated circuit chip packages	—	2000-04-25	$79,783,000
6030859	Method of making a packaged semiconductor device and a lead-frame therefor	Ichiro Anjoh, Gen Murakami, Katherine G. Heinen	2000-02-29
5994169	Lead frame for integrated circuits and process of packaging	Katherine G. Heinen	1999-11-30	$38,195,000
5840599	Process of packaging an integrated circuit with a conductive material between a lead frame and the face of the circuit	Katherine G. Heinen	1998-11-24	$15,060,000
5648299	Packaged semiconductor device and a leadframe therefor	Ichiro Anjoh, Gen Murakami, Katherine G. Heinen	1997-07-15
5585665	Packaged semiconductor device and a leadframe therefor	Ichiro Anjoh, Gen Murakami, Katherine G. Heinen	1996-12-17
5442233	Packaged semiconductor device and a lead frame therefor, having a common potential lead with lead portions having dual functions of chip support and heat dissipation	Ichiro Anjoh, Gen Murakami, Katherine G. Heinen	1995-08-15
5432127	Method for making a balanced capacitance lead frame for integrated circuits having a power bus and dummy leads	Katherine G. Heinen	1995-07-11	$12,698,000