Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7795072 | Structure and method of high performance two layer ball grid array substrate | Michael A. Lamson | 2010-09-14 |
| 7309648 | Low profile, chip-scale package and method of fabrication | Jeremias P. Libres, Michael Paul Pierce | 2007-12-18 |
| 7135781 | Low profile, chip-scale package and method of fabrication | Jeremias P. Libres, Michael Paul Pierce | 2006-11-14 |
| 6995037 | Structure and method of high performance two layer ball grid array substrate | Michael A. Lamson | 2006-02-07 |
| 6794743 | Structure and method of high performance two layer ball grid array substrate | Michael A. Lamson | 2004-09-21 |
| 6396136 | Ball grid package with multiple power/ground planes | Masood Murtuza, Raymond W. Thompson | 2002-05-28 |
| 6084777 | Ball grid array package | Nozar Hassanzadeh, Michael A. Lamson | 2000-07-04 |
| 5976914 | Method of making plastic package for a surface mounted integrated circuit | John H. Abbott, Raymond W. Thompson | 1999-11-02 |
| 5895967 | Ball grid array package having a deformable metal layer and method | William P. Stearns, Nozar Hassanzadeh | 1999-04-20 |
| 5777382 | Plastic packaging for a surface mounted integrated circuit | John H. Abbott, Raymond W. Thompson | 1998-07-07 |
| 4540226 | Intelligent electronic connection socket | Raymond W. Thompson, John H. Abbott, David S. Laffitte | 1985-09-10 |