Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7309648 | Low profile, chip-scale package and method of fabrication | Navinchandra Kalidas, Jeremias P. Libres | 2007-12-18 |
| 7135781 | Low profile, chip-scale package and method of fabrication | Navinchandra Kalidas, Jeremias P. Libres | 2006-11-14 |
| 6094358 | Card stiffener optimized for connector engagement | Steven Michael Christensen, Ciro Neal Ramirez | 2000-07-25 |