Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6396136 | Ball grid package with multiple power/ground planes | Navinchandra Kalidas, Masood Murtuza | 2002-05-28 |
| 5976914 | Method of making plastic package for a surface mounted integrated circuit | John H. Abbott, Navinchandra Kalidas | 1999-11-02 |
| 5777382 | Plastic packaging for a surface mounted integrated circuit | John H. Abbott, Navinchandra Kalidas | 1998-07-07 |
| 4540226 | Intelligent electronic connection socket | Navinchandra Kalidas, John H. Abbott, David S. Laffitte | 1985-09-10 |