Issued Patents All Time
Showing 26–28 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7956456 | Thermal interface material design for enhanced thermal performance and improved package structural integrity | Paul J. Hundt, Vikas Gupta | 2011-06-07 |
| 7838988 | Stud bumps as local heat sinks during transient power operations | Kapil Heramb Sahasrabudhe, Vikas Gupta | 2010-11-23 |
| 7572679 | Heat extraction from packaged semiconductor chips, scalable with chip area | Vikas Gupta, Gregory E. Howard | 2009-08-11 |