Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7679190 | Raised solder-mask-defined (SMD) solder ball pads for a laminate electronic circuit board | Tz-Cheng Chiu | 2010-03-16 |
| 7294451 | Raised solder-mask-defined (SMD) solder ball pads for a laminate electronic circuit board | Tz-Cheng Chiu | 2007-11-13 |
| 7085699 | Wire bonding simulation | — | 2006-08-01 |
| 6953707 | Method and system for chip-to-package interconnection | — | 2005-10-11 |
| 6696644 | Polymer-embedded solder bumps for reliable plastic package attachment | Tz-Cheng Chiu | 2004-02-24 |