Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11850805 | Method for manufacturing PDMS device and PDMS device manufactured thereby | Taek Dong Chung, Jeong-Yun Sun, Seok-Hee Han, Sung-Il Kim, Hae-Ryung Lee +1 more | 2023-12-26 |
| 11525189 | Method of manufacturing MoS2 having 1T crystal structure | Won Hyo Joo, Dae Hyun Nam, Ji Yong Kim | 2022-12-13 |
| 11474069 | Open-junction ionic transistor | Jeong-Yun Sun, Taek Dong Chung, Hae-Ryung Lee, Seung-Min Lim, Seok-Hee Han +1 more | 2022-10-18 |
| 11008673 | Chalcogenide-carbon nanofiber and preparation method therefor | Dae Hyun Nam | 2021-05-18 |
| 10682698 | Metal-carbon nanofiber and production method thereof | Dae Hyun Nam, Ji Hoon Lee, Na Rae Kim, Yoo Yong Lee, Han-Wool YEON +1 more | 2020-06-16 |
| 9510445 | Member for flexible element and manufacturing method thereof | In Suk Choi, Myoung Woon Moon, Byoung Joon Kim, Min Suk Jung | 2016-11-29 |
| 8410373 | Printed circuit substrate and method of manufacturing the same | Hyung Wook Park, Hong Seok Min, Young Gwan Ko, Chang-Sup Ryu, Ho Young Lee +2 more | 2013-04-02 |
| 8216635 | Method of forming metal wiring and metal wiring formed using the same | Young Ah Song, Ji Hoon Lee, Seol Min Yi, Jae-Woo Joung, Sung I. Oh +2 more | 2012-07-10 |
| 7929330 | Multi-bit memory device using multi-plug | Deok-kee Kim, Ha-young You, Jung-hun Sung, Soo-Jung Hwang, Sung-yup Jung | 2011-04-19 |
| 6821901 | Method of through-etching substrate | Seung Jin Song, Kyoungdoug Min, Hong Seok Min, Sejun Kim, Kun-joong Park | 2004-11-23 |
| 6633083 | Barrier layer integrity test | Christy Mei-Chu Woo, Todd P. Lukanc | 2003-10-14 |
| 6348701 | Method for determining metal concentration in a field area | Amit P. Marathe | 2002-02-19 |
| 6339958 | Adhesion strength testing using a depth-sensing indentation technique | Ting Tsui | 2002-01-22 |
| 6242349 | Method of forming copper/copper alloy interconnection with reduced electromigration | Takeshi Nogami, Sergey Lopatin | 2001-06-05 |
| 6242924 | Method for electronically measuring size of internal void in electrically conductive lead | Tsui Ting Yiu, Yow-Juang Liu, Sunil N. Shabde | 2001-06-05 |
| 6228768 | Storage-annealing plated CU interconnects | Christy Mei-Chu Woo | 2001-05-08 |
| 6124203 | Method for forming conformal barrier layers | Dirk Brown, Simon S. Chan | 2000-09-26 |
| 6121141 | Method of forming a void free copper interconnects | Christy Mei-Chu Woo, Dirk Brown, Imran Hashim | 2000-09-19 |
| 6053034 | Method for measuring fracture toughness of thin films | Ting Tsui | 2000-04-25 |