| 11490812 |
Systems and methods for monitoring and detecting symptoms of infectious conditions |
— |
2022-11-08 |
$2,442,000 |
| 9495491 |
Reliability aware thermal design |
Kingsuk Maitra, Tung Thanh Nguyen, Brian K. Langendorf, Julia Purtell, Rune Hartung Jensen +1 more |
2016-11-15 |
$54,363,000 |
| 8501504 |
Method and system for non-destructive determination of dielectric breakdown voltage in a semiconductor wafer |
Kok Yong Yiang, Rick Francis, Van-Hung Pham |
2013-08-06 |
$2,454,000 |
| 8022716 |
Dielectric breakdown lifetime enhancement using alternating current (AC) capacitance |
Kok Yong Yiang, Rick Francis, Van-Hung Pham |
2011-09-20 |
$13,504,000 |
| 7755194 |
Composite barrier layers with controlled copper interface surface roughness |
Connie P. Wang, Christy Mei-Chu Woo, Paul L. King |
2010-07-13 |
$9,965,000 |
| 7451411 |
Integrated circuit design system |
Christine Hau-Riege |
2008-11-11 |
$5,286,000 |
| 7379924 |
Quantifying and predicting the impact of line edge roughness on device reliability and performance |
Calvin T. Gabriel |
2008-05-27 |
$41,100,000 |
| 7340360 |
Method for determining projected lifetime of semiconductor devices with analytical extension of stress voltage window by scaling of oxide thickness |
John H. Zhang, Kurt Taylor, Eugene Zhao, Rolf Geilenkeuser, Joerg-Oliver Weidner |
2008-03-04 |
$9,869,000 |
| 7310155 |
Extraction of tool independent line-edge-roughness (LER) measurements using in-line programmed LER and reliability structures |
Luigi Capodieci, Bhanwar Singh, Ramkumar Subramanian |
2007-12-18 |
$12,803,000 |
| 7288782 |
Use of Ta-capped metal line to improve formation of memory element films |
Steven C. Avanzino |
2007-10-30 |
|
| 7155359 |
Determination of device failure characteristic |
Hyeon-Seag Kim, Kurt Taylor |
2006-12-26 |
$21,181,000 |
| 7146588 |
Predicting EM reliability by decoupling extrinsic and intrinsic sigma |
Darrell M. Erb |
2006-12-05 |
$14,281,000 |
| 7084062 |
Use of Ta-capped metal line to improve formation of memory element films |
Steven C. Avanzino |
2006-08-01 |
|
| 7033940 |
Method of forming composite barrier layers with controlled copper interface surface roughness |
Connie P. Wang, Christy Mei-Chu Woo, Paul L. King |
2006-04-25 |
$9,950,000 |
| 7026225 |
Semiconductor component and method for precluding stress-induced void formation in the semiconductor component |
Christine Hau-Riege, John Sanchez |
2006-04-11 |
$9,016,000 |
| 6952052 |
Cu interconnects with composite barrier layers for wafer-to-wafer uniformity |
Connie P. Wang, Christy Mei-Chu Woo |
2005-10-04 |
$16,745,000 |
| 6939803 |
Method for forming conductor reservoir volume for integrated circuit interconnects |
Pin-Chin Connie Wang, Christy Mei-Chu Woo |
2005-09-06 |
$13,866,000 |
| 6897476 |
Test structure for determining electromigration and interlayer dielectric failure |
Hyeon-Seag Kim, Seung-Hyun Rhee, Christine Hau-Riege |
2005-05-24 |
$6,015,000 |
| 6867056 |
System and method for current-enhanced stress-migration testing of interconnect |
Christine Hau-Riege |
2005-03-15 |
$4,259,000 |
| 6858511 |
Method of semiconductor via testing |
— |
2005-02-22 |
$8,271,000 |
| 6856160 |
Maximum VCC calculation method for hot carrier qualification |
Hyeon-Seag Kim, Nian Yang, Tien-Chun Yang |
2005-02-15 |
$5,967,000 |
| 6825684 |
Hot carrier oxide qualification method |
Hyeon-Seag Kim, Nian Yang, Tien-Chun Yang |
2004-11-30 |
$7,368,000 |
| 6822437 |
Interconnect test structure with slotted feeder lines to prevent stress-induced voids |
Christine Hau-Riege, John Sanchez |
2004-11-23 |
$3,336,000 |
| 6822473 |
Determination of permeability of layer material within interconnect |
Christine Hau-Riege, Stefan Hau-Riege |
2004-11-23 |
$3,336,000 |
| 6770847 |
Method and system for Joule heating characterization |
Huade Walter Yao, Van-Hung Pham |
2004-08-03 |
$1,898,000 |
