Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8501504 | Method and system for non-destructive determination of dielectric breakdown voltage in a semiconductor wafer | Kok Yong Yiang, Rick Francis, Amit P. Marathe | 2013-08-06 |
| 8022716 | Dielectric breakdown lifetime enhancement using alternating current (AC) capacitance | Kok Yong Yiang, Rick Francis, Amit P. Marathe | 2011-09-20 |
| 6770847 | Method and system for Joule heating characterization | Huade Walter Yao, Amit P. Marathe | 2004-08-03 |
| 6329831 | Method and apparatus for reliability testing of integrated circuit structures and devices | Nguyen Duc Bui, Michael Anthony Niederhofer | 2001-12-11 |
| 6100101 | Sensitive technique for metal-void detection | Amit P. Marathe, Nguyen Duc Bui | 2000-08-08 |
| 6075293 | Semiconductor device having a multi-layer metal interconnect structure | Xiao-Yu Li, Sunil Mehta, Amit P. Marathe | 2000-06-13 |
| 5786705 | Method for evaluating the effect of a barrier layer on electromigration for plug and non-plug interconnect systems | Nguyen Duc Bui, John T. Yue | 1998-07-28 |
| 5612627 | Method for evaluating the effect of a barrier layer on electromigration for plug and non-plug interconnect systems | Nguyen Duc Bui, John T. Yue | 1997-03-18 |