Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7340360 | Method for determining projected lifetime of semiconductor devices with analytical extension of stress voltage window by scaling of oxide thickness | John H. Zhang, Kurt Taylor, Amit P. Marathe, Rolf Geilenkeuser, Joerg-Oliver Weidner | 2008-03-04 |
| 6949020 | Methods for making reinforced wafer polishing pads and apparatuses implementing the same | Cangshan Xu, Fen Dai | 2005-09-27 |
| 6939207 | Method and apparatus for controlling CMP pad surface finish | Alan J. Jensen, Mario Stella, Peter Renteln, Jeffrey Farber | 2005-09-06 |
| 6798230 | Structure and method for increasing accuracy in predicting hot carrier injection (HCI) degradation in semiconductor devices | Kurt Taylor, Jay CHAN | 2004-09-28 |
| 6776917 | Chemical mechanical polishing thickness control in magnetic head fabrication | Richard Hsiao, Son V. Nguyen, Thao Pham | 2004-08-17 |
| 6712679 | Platen assembly having a topographically altered platen surface | Travis R. Taylor, Cangshan Xu, Kevin T. Crofton | 2004-03-30 |
| 6645052 | Method and apparatus for controlling CMP pad surface finish | Alan J. Jensen, Mario Stella, Peter Renteln, Jeffrey Farber | 2003-11-11 |
| 6641470 | Apparatus for accurate endpoint detection in supported polishing pads | Kang Jia, Michael D. Steiman, Herbert E. Litvak, Christian D. Frederickson | 2003-11-04 |
| 6572463 | Methods for making reinforced wafer polishing pads utilizing direct casting and apparatuses implementing the same | Cangshan Xu, Fen Dai | 2003-06-03 |
| 6561889 | Methods for making reinforced wafer polishing pads and apparatuses implementing the same | Cangshan Xu, Fen Dai | 2003-05-13 |