Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7340360 | Method for determining projected lifetime of semiconductor devices with analytical extension of stress voltage window by scaling of oxide thickness | John H. Zhang, Eugene Zhao, Amit P. Marathe, Rolf Geilenkeuser, Joerg-Oliver Weidner | 2008-03-04 |
| 7205165 | Method for determining the reliability of dielectric layers | Akram A. Salman, Xuejun Zhao, Stephen G. Beebe | 2007-04-17 |
| 7155359 | Determination of device failure characteristic | Hyeon-Seag Kim, Amit P. Marathe | 2006-12-26 |
| 6798230 | Structure and method for increasing accuracy in predicting hot carrier injection (HCI) degradation in semiconductor devices | Jay CHAN, Eugene Zhao | 2004-09-28 |
| 6762613 | Testing system and method of operation therefor including a test fixture for electrical testing of semiconductor chips above a thermal threshold temperature of an interlayer dielectric material | Huade Walter Yao | 2004-07-13 |
| 6514802 | Method of providing a frontside contact to a substrate of SOI device | Todd P. Lukanc | 2003-02-04 |
| 6516450 | Variable design rule tool | Wiley Eugene Hill, Chern-Jiann Lee, Rithy Hang, Todd P. Lukanc | 2003-02-04 |
| 6362524 | Edge seal ring for copper damascene process and method for fabrication thereof | Richard C. Blish, II, David C. Greenlaw | 2002-03-26 |
| 6355511 | Method of providing a frontside contact to substrate of SOI device | Todd P. Lukanc | 2002-03-12 |