JF

Jeffrey Farber

Lam Research: 15 patents #187 of 2,128Top 9%
Overall (All Time): #324,036 of 4,157,543Top 8%
15
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
8726919 Method and system for uniformly applying a multi-phase cleaning solution to a substrate Ji Zhu, Carl Woods, John M. de Larios 2014-05-20
8671959 Method and apparatus for cleaning a substrate using non-newtonian fluids John M. de Larios, Mike Ravkin, Mikhail Korolik, Fred C. Redeker 2014-03-18
8567421 Method and system for uniformly applying a multi-phase cleaning solution to a substrate Ji Zhu, Carl Woods, John M. de Larios 2013-10-29
8535451 Method and apparatus for cleaning semiconductor wafers using compressed and/or pressurized foams, bubbles, and/or liquids John M. de Larios, Mike Ravkin, Mikhail Korolik, Fritz Redeker, Aleksander Owczarz 2013-09-17
8043441 Method and apparatus for cleaning a substrate using non-Newtonian fluids John M. de Larios, Mike Ravkin, Mikhail Korolik, Fred C. Redeker 2011-10-25
7913703 Method and apparatus for uniformly applying a multi-phase cleaning solution to a substrate Ji Zhu, Carl Woods, John M. de Larios 2011-03-29
7811424 Reducing mechanical resonance and improved distribution of fluids in small volume processing of semiconductor materials Carl Woods 2010-10-12
7735177 Brush core assembly Christopher Pena, Edward Orbeta 2010-06-15
7614411 Controls of ambient environment during wafer drying using proximity head Mikhail Korolik, John M. de Larios, Mike Ravkin 2009-11-10
7568490 Method and apparatus for cleaning semiconductor wafers using compressed and/or pressurized foams, bubbles, and/or liquids John M. de Larios, Mike Ravkin, Mikhail Korolik, Fritz Redeker, Aleksander Owczarz 2009-08-04
7452408 System and method for producing bubble free liquids for nanometer scale semiconductor processing Carl Woods 2008-11-18
6939207 Method and apparatus for controlling CMP pad surface finish Alan J. Jensen, Mario Stella, Eugene Zhao, Peter Renteln 2005-09-06
6645052 Method and apparatus for controlling CMP pad surface finish Alan J. Jensen, Mario Stella, Eugene Zhao, Peter Renteln 2003-11-11
6405399 Method and system of cleaning a wafer after chemical mechanical polishing or plasma processing Julia Svirchevski 2002-06-18
6187684 Methods for cleaning substrate surfaces after etch operations Allan M. Radman, Helmuth Treichel 2001-02-13