Issued Patents All Time
Showing 51–58 of 58 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6432822 | Method of improving electromigration resistance of capped Cu | Minh Van Ngo, Steven C. Avanzino | 2002-08-13 |
| 6433402 | Selective copper alloy deposition | Christy Mei-Chu Woo, Pin-Chin Connie Wang, Diana M. Schonauer | 2002-08-13 |
| 6426293 | Minimizing resistance and electromigration of interconnect by adjusting anneal temperature and amount of seed layer dopant | Pin-Chin Connie Wang, Sergey Lopatin | 2002-07-30 |
| 6417566 | Void eliminating seed layer and conductor core integrated circuit interconnects | Pin-Chin Connie Wang | 2002-07-09 |
| 6348701 | Method for determining metal concentration in a field area | Young-Chang Joo | 2002-02-19 |
| 6309959 | Formation of self-aligned passivation for interconnect to minimize electromigration | Pin-Chin Connie Wang, Lu You, Joffre F. Bernard | 2001-10-30 |
| 6100101 | Sensitive technique for metal-void detection | Nguyen Duc Bui, Van-Hung Pham | 2000-08-08 |
| 6075293 | Semiconductor device having a multi-layer metal interconnect structure | Xiao-Yu Li, Sunil Mehta, Van-Hung Pham | 2000-06-13 |