Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6720264 | Prevention of precipitation defects on copper interconnects during CMP by use of solutions containing organic compounds with silica adsorption and copper corrosion inhibiting properties | Kashmir Sahota, Johannes Groschopf, Gerd Marxsen, Steven C. Avanzino | 2004-04-13 |
| 6596637 | Chemically preventing Cu dendrite formation and growth by immersion | Steven C. Avanzino, Kai Yang | 2003-07-22 |
| 6528409 | Interconnect structure formed in porous dielectric material with minimized degradation and electromigration | Sergey Lopatin, Fei Wang, Steven C. Avanzino | 2003-03-04 |
| 6503418 | Ta barrier slurry containing an organic additive | Kashmir Sahota, Steven C. Avanzino | 2003-01-07 |
| 6433402 | Selective copper alloy deposition | Christy Mei-Chu Woo, Pin-Chin Connie Wang, Amit P. Marathe | 2002-08-13 |
| 6319833 | Chemically preventing copper dendrite formation and growth by spraying | Steven C. Avanzino, Kai Yang | 2001-11-20 |
| 6218290 | Copper dendrite prevention by chemical removal of dielectric | Steven C. Avanzino, Kai Yang | 2001-04-17 |
| 6207569 | Prevention of Cu dendrite formation and growth | Steven C. Avanzino, Kai Yang | 2001-03-27 |
| 6197690 | Chemically preventing Cu dendrite formation and growth by double sided scrubbing | Steven C. Avanzino, Kai Yang | 2001-03-06 |
| 6177349 | Preventing Cu dendrite formation and growth | Steven C. Avanzino, Kai Yang | 2001-01-23 |
| 6169034 | Chemically removable Cu CMP slurry abrasive | Steven C. Avanzino, Darrell M. Erb, Kai Yang | 2001-01-02 |
| 6162727 | Chemical treatment for preventing copper dendrite formation and growth | Steven C. Avanzino, Kai Yang | 2000-12-19 |
| 6153933 | Elimination of residual materials in a multiple-layer interconnect structure | Darin A. Chan, Steven C. Avanzino, Subramanian Venkatkrishnan, Minh Van Ngo, Christy Mei-Chu Woo de la Girond'arc | 2000-11-28 |
| 6140239 | Chemically removable Cu CMP slurry abrasive | Steven C. Avanzino, Darrell M. Erb, Kai Yang | 2000-10-31 |
| 6074949 | Method of preventing copper dendrite formation and growth | Steven C. Avanzino, Kai Yang | 2000-06-13 |
| 5936307 | Surface modification method for film stress reduction | Subhash Gupta, Paul R. Besser, Bhanwar Singh | 1999-08-10 |
| 5916855 | Chemical-mechanical polishing slurry formulation and method for tungsten and titanium thin films | Steven C. Avanzino, Christy Mei-Chu Woo, Peter A. Burke | 1999-06-29 |
| 5702563 | Reduced chemical-mechanical polishing particulate contamination | Isidore Salugsugan | 1997-12-30 |
| 5662769 | Chemical solutions for removing metal-compound contaminants from wafers after CMP and the method of wafer cleaning | Steven C. Avanzino | 1997-09-02 |