Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6153933 | Elimination of residual materials in a multiple-layer interconnect structure | Darin A. Chan, Steven C. Avanzino, Subramanian Venkatkrishnan, Minh Van Ngo, Diana M. Schonauer | 2000-11-28 |