Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6403385 | Method of inspecting a semiconductor wafer for defects | Tho Le La, Pei-Yuan Gao, Richard Lamm | 2002-06-11 |
| 6153933 | Elimination of residual materials in a multiple-layer interconnect structure | Darin A. Chan, Steven C. Avanzino, Minh Van Ngo, Christy Mei-Chu Woo de la Girond'arc, Diana M. Schonauer | 2000-11-28 |
| 6136510 | Doubled-sided wafer scrubbing for improved photolithography | Tho Le La, Mark T. Ramsbey, Jack F. Thomas, Kathleen R. Early | 2000-10-24 |
| 5780204 | Backside wafer polishing for improved photolithography | Tho Le La, Mark T. Ramsbey, Jack F. Thomas, Kathleen R. Early | 1998-07-14 |
| 5769696 | Chemical-mechanical polishing of thin materials using non-baked carrier film | Dawn M. Lee | 1998-06-23 |
| 5766058 | Chemical-mechanical polishing using curved carriers | Dawn M. Lee | 1998-06-16 |