| 6713394 |
Process for planarization of integrated circuit structure which inhibits cracking of low dielectric constant dielectric material adjacent underlying raised structures |
Ronald J. Nagahara, Jayanthi Pallinti |
2004-03-30 |
| 6607967 |
Process for forming planarized isolation trench in integrated circuit structure on semiconductor substrate |
Jayanthi Pallinti, Ronald J. Nagahara |
2003-08-19 |
| 6531397 |
Method and apparatus for using across wafer back pressure differentials to influence the performance of chemical mechanical polishing |
Ronald J. Nagahara |
2003-03-11 |
| 6489242 |
Process for planarization of integrated circuit structure which inhibits cracking of low dielectric constant dielectric material adjacent underlying raised structures |
Ronald J. Nagahara, Jayanthi Pallinti |
2002-12-03 |
| 6391768 |
Process for CMP removal of excess trench or via filler metal which inhibits formation of concave regions on oxide surface of integrated circuit structure |
Jayanthi Pallinti, Weidan Li, Ming-Yi Lee |
2002-05-21 |
| 6179956 |
Method and apparatus for using across wafer back pressure differentials to influence the performance of chemical mechanical polishing |
Ronald J. Nagahara |
2001-01-30 |
| 6168508 |
Polishing pad surface for improved process control |
Ronald J. Nagahara |
2001-01-02 |
| 6106371 |
Effective pad conditioning |
Ronald J. Nagahara |
2000-08-22 |
| 6074288 |
Modified carrier films to produce more uniformly polished substrate surfaces |
Ronald J. Nagahara |
2000-06-13 |
| 6066266 |
In-situ chemical-mechanical polishing slurry formulation for compensation of polish pad degradation |
Richard S. Osugi, Ronald J. Nagahara |
2000-05-23 |
| 6004193 |
Dual purpose retaining ring and polishing pad conditioner |
Ron Nagahara |
1999-12-21 |
| 5961375 |
Shimming substrate holder assemblies to produce more uniformly polished substrate surfaces |
Ronald J. Nagahara |
1999-10-05 |
| 5944585 |
Use of abrasive tape conveying assemblies for conditioning polishing pads |
Ronald J. Nagahara |
1999-08-31 |
| 5941761 |
Shaping polishing pad to control material removal rate selectively |
Ronald J. Nagahara |
1999-08-24 |
| 5931719 |
Method and apparatus for using pressure differentials through a polishing pad to improve performance in chemical mechanical polishing |
Ronald J. Nagahara |
1999-08-03 |
| 5863825 |
Alignment mark contrast enhancement |
Nicholas F. Pasch, Marilyn Hwan, Richard S. Osugi, Colin D. Yates, Shumay X. Dou |
1999-01-26 |
| 5816900 |
Apparatus for polishing a substrate at radially varying polish rates |
Ron Nagahara |
1998-10-06 |
| 5769696 |
Chemical-mechanical polishing of thin materials using non-baked carrier film |
Subramanian Venkatkrishnan |
1998-06-23 |
| 5766058 |
Chemical-mechanical polishing using curved carriers |
Subramanian Venkatkrishnan |
1998-06-16 |
