Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6951808 | Metal planarization system | Jayanthi Pallinti, Samuel V. Dunton | 2005-10-04 |
| 6752916 | Electrochemical planarization end point detection | Yan Fang, Jayanthi Pallinti | 2004-06-22 |
| 6713394 | Process for planarization of integrated circuit structure which inhibits cracking of low dielectric constant dielectric material adjacent underlying raised structures | Jayanthi Pallinti, Dawn M. Lee | 2004-03-30 |
| 6607967 | Process for forming planarized isolation trench in integrated circuit structure on semiconductor substrate | Jayanthi Pallinti, Dawn M. Lee | 2003-08-19 |
| 6586326 | Metal planarization system | Jayanthi Pallinti, Samuel V. Dunton | 2003-07-01 |
| 6531397 | Method and apparatus for using across wafer back pressure differentials to influence the performance of chemical mechanical polishing | Dawn M. Lee | 2003-03-11 |
| 6503828 | Process for selective polishing of metal-filled trenches of integrated circuit structures | James J. Xie, Akihisa Ueno, Jayanthi Pallinti | 2003-01-07 |
| 6489242 | Process for planarization of integrated circuit structure which inhibits cracking of low dielectric constant dielectric material adjacent underlying raised structures | Jayanthi Pallinti, Dawn M. Lee | 2002-12-03 |
| 6417093 | Process for planarization of metal-filled trenches of integrated circuit structures by forming a layer of planarizable material over the metal layer prior to planarizing | James J. Xie, Jayanthi Pallinti, Akihisa Ueno | 2002-07-09 |
| 6372524 | Method for CMP endpoint detection | James J. Xie, Jayanthi Pallinti | 2002-04-16 |
| 6179956 | Method and apparatus for using across wafer back pressure differentials to influence the performance of chemical mechanical polishing | Dawn M. Lee | 2001-01-30 |
| 6168508 | Polishing pad surface for improved process control | Dawn M. Lee | 2001-01-02 |
| 6114215 | Generating non-planar topology on the surface of planar and near-planar substrates | Richard S. Osugi | 2000-09-05 |
| 6106371 | Effective pad conditioning | Dawn M. Lee | 2000-08-22 |
| 6074288 | Modified carrier films to produce more uniformly polished substrate surfaces | Dawn M. Lee | 2000-06-13 |
| 6066266 | In-situ chemical-mechanical polishing slurry formulation for compensation of polish pad degradation | Richard S. Osugi, Dawn M. Lee | 2000-05-23 |
| 5961375 | Shimming substrate holder assemblies to produce more uniformly polished substrate surfaces | Dawn M. Lee | 1999-10-05 |
| 5944585 | Use of abrasive tape conveying assemblies for conditioning polishing pads | Dawn M. Lee | 1999-08-31 |
| 5941761 | Shaping polishing pad to control material removal rate selectively | Dawn M. Lee | 1999-08-24 |
| 5931719 | Method and apparatus for using pressure differentials through a polishing pad to improve performance in chemical mechanical polishing | Dawn M. Lee | 1999-08-03 |