Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8373148 | Memory device with improved performance | Zhida Lan, Manuj Rathor | 2013-02-12 |
| 8093698 | Gettering/stop layer for prevention of reduction of insulating oxide in metal-insulator-metal device | Manuj Rathor, Matthew S. Buynoski, Steven C. Avanzino, Suzette K. Pangrle | 2012-01-10 |
| 7790497 | Method to prevent alloy formation when forming layered metal oxides by metal oxidation | Steven C. Avanzino, Jeffrey A. Shields, Suzette K. Pangrle | 2010-09-07 |
| 6811671 | Method of controlling zinc-doping in a copper-zinc alloy thin film electroplated on a copper surface and a semiconductor device thereby formed | Sergey Lopatin, Alexander H. Nickel | 2004-11-02 |
| 6770559 | Method of forming wiring by implantation of seed layer material | Ercan Adem, Fei Wang | 2004-08-03 |
| 6630741 | Method of reducing electromigration by ordering zinc-doping in an electroplated copper-zinc interconnect and a semiconductor device thereby formed | Sergey Lopatin, Paul L. King | 2003-10-07 |
| 6624074 | Method of fabricating a semiconductor device by calcium doping a copper surface using a chemical solution | Sergey Lopatin, Paul L. King | 2003-09-23 |
| 6621165 | Semiconductor device fabricated by reducing carbon, sulphur, and oxygen impurities in a calcium-doped copper surface | Sergey Lopatin, Paul L. King | 2003-09-16 |
| 6541286 | Imaging of integrated circuit interconnects | Minh Quoc Tran | 2003-04-01 |
| 6541860 | Barrier-to-seed layer alloying in integrated circuit interconnects | Christy Mei-Chu Woo, Pin-Chin Connie Wang | 2003-04-01 |
| 6515367 | Sub-cap and method of manufacture therefor in integrated circuit capping layers | Minh Van Ngo, Tim Z. Hossain | 2003-02-04 |
| 6479898 | Dielectric treatment in integrated circuit interconnects | Dawn Hopper, Minh Van Ngo | 2002-11-12 |
| 6469387 | Semiconductor device formed by calcium doping a copper surface using a chemical solution | Sergey Lopatin, Paul L. King | 2002-10-22 |
| 6465867 | Amorphous and gradated barrier layer for integrated circuit interconnects | Sergey Lopatin | 2002-10-15 |
| 6444580 | Method of reducing carbon, sulphur, and oxygen impurities in a calcium-doped copper surface and semiconductor device thereby formed | Sergey Lopatin, Paul L. King | 2002-09-03 |
| 6406996 | Sub-cap and method of manufacture therefor in integrated circuit capping layers | Minh Van Ngo, Tim Z. Hossain | 2002-06-18 |
| 6309959 | Formation of self-aligned passivation for interconnect to minimize electromigration | Pin-Chin Connie Wang, Lu You, Amit P. Marathe | 2001-10-30 |