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Gap-filling with uniform properties |
Alexander H. Nickel, Lu You, Hirokazu Tokuno, Minh Quoc Tran, Hieu Pham +2 more |
2013-04-09 |
| 8133801 |
Method for forming a semiconducting layer with improved gap filling properties |
Rinji Sugino, Yider Wu, Jeffrey S. Glick, Kuo-Tung Chang |
2012-03-13 |
| 7071086 |
Method of forming a metal gate structure with tuning of work function by silicon incorporation |
Christy Mei-Chu Woo, Paul R. Besser, James Pan, Jinsong Yin |
2006-07-04 |
| 6989601 |
Copper damascene with low-k capping layer and improved electromigration reliability |
Jeremy I. Martin, Hartmut Ruelke |
2006-01-24 |
| 6764951 |
Method for forming nitride capped Cu lines with reduced hillock formation |
— |
2004-07-20 |
| 6492258 |
METHOD FOR REDUCING STRESS-INDUCED VOIDS FOR 0.25-&mgr;M AND SMALLER SEMICONDUCTOR CHIP TECHNOLOGY BY ANNEALING INTERCONNECT LINES AND USING LOW BIAS VOLTAGE AND LOW INTERLAYER DIELECTRIC DEPOSITION RATE AND SEMICONDUCTOR CHIP MADE THEREBY |
Paul R. Besser, Matthew S. Buynoski, John Caffall, Nick Maccrae, Richard J. Huang +1 more |
2002-12-10 |
| 6472336 |
Forming an encapsulating layer after deposition of a dielectric comprised of corrosive material |
Suzette K. Pangrle, Richard J. Huang |
2002-10-29 |
| 6429141 |
Method of manufacturing a semiconductor device with improved line width accuracy |
Bhanwar Singh, Dawn Hopper, Carmen Morales |
2002-08-06 |
| 6406996 |
Sub-cap and method of manufacture therefor in integrated circuit capping layers |
Joffre F. Bernard, Tim Z. Hossain |
2002-06-18 |
| 6329718 |
Method for reducing stress-induced voids for 0.25m.mu. and smaller semiconductor chip technology by annealing interconnect lines and using low bias voltage and low interlayer dielectric deposition rate and semiconductor chip made thereby |
Paul R. Besser, Matthew S. Buynoski, John Caffall, Nick Maccrae, Richard J. Huang +1 more |
2001-12-11 |
| 6297148 |
Method of forming a silicon bottom anti-reflective coating with reduced junction leakage during salicidation |
Paul R. Besser, Yowjuang Bill Liu |
2001-10-02 |
| 6153523 |
Method of forming high density capping layers for copper interconnects with improved adhesion |
Robin Cheung |
2000-11-28 |
| 5963841 |
Gate pattern formation using a bottom anti-reflective coating |
Olov Karlsson, Christopher F. Lyons, Scott A. Bell, David K. Foote |
1999-10-05 |