| 8629535 |
Mask for forming integrated circuit |
Richard J. Huang, Scott A. Bell, Srikanteswara Dakshina-Murthy, Philip A. Fisher, Richard Nguyen +1 more |
2014-01-14 |
$18,205,000 |
| 8415256 |
Gap-filling with uniform properties |
Alexander H. Nickel, Hirokazu Tokuno, Minh Quoc Tran, Minh Van Ngo, Hieu Pham +2 more |
2013-04-09 |
|
| 8202810 |
Low-H plasma treatment with N2 anneal for electronic memory devices |
Alexander H. Nickel, Allen L. Evans, Minh Quoc Tran, Minh Van Ngo, Pei-Yuan Gao +4 more |
2012-06-19 |
$1,687,000 |
| 8026169 |
Cu annealing for improved data retention in flash memory devices |
Alexander H. Nickel, Minh Quoc Tran, Minh Van Ngo, Hieu Pham, Erik Wilson +4 more |
2011-09-27 |
$6,329,000 |
| 7884030 |
Gap-filling with uniform properties |
Alexander H. Nickel, Hirokazu Tokuno, Minh Quoc Tran, Minh Van Ngo, Hieu Pham +2 more |
2011-02-08 |
|
| 7534732 |
Semiconductor devices with copper interconnects and composite silicon nitride capping layers |
Minh Van Ngo, Erik Wilson, Hieu Pham, Robert A. Huertas, Hirokazu Tokuno +2 more |
2009-05-19 |
$8,842,000 |
| 7521304 |
Method for forming integrated circuit |
Richard J. Huang, Scott A. Bell, Srikanteswara Dakshina-Murthy, Philip A. Fisher, Richard Nguyen +1 more |
2009-04-21 |
$10,235,000 |
| 7494885 |
Disposable spacer process for field effect transistor fabrication |
Mario M. Pelella, Darin A. Chan, Kei-Leong Ho |
2009-02-24 |
$4,276,000 |
| 7378310 |
Method for manufacturing a memory device having a nanocrystal charge storage region |
Connie P. Wang, Zoran Krivokapic, Suzette K. Pangrle, Robert J. Chiu |
2008-05-27 |
|
| 7309650 |
Memory device having a nanocrystal charge storage region and method |
Connie P. Wang, Zoran Krivokapic, Paul R. Besser, Suzette K. Pangrle |
2007-12-18 |
|
| 7256499 |
Ultra low dielectric constant integrated circuit system |
Fei Wang, Minh Quoc Tran, Lynne A. Okada |
2007-08-14 |
$3,919,000 |
| 7208418 |
Sealing sidewall pores in low-k dielectrics |
Lynne A. Okada, Minh Quoc Tran, Fei Wang |
2007-04-24 |
$10,633,000 |
| 7183198 |
Method for forming a hardmask employing multiple independently formed layers of a capping material to reduce pinholes |
Pei-Yuan Gao, Richard J. Huang |
2007-02-27 |
$9,460,000 |
| 7169706 |
Method of using an adhesion precursor layer for chemical vapor deposition (CVD) copper deposition |
Sergey Lopatin, Paul R. Besser, Alline F. Myers, Jeremias D. Romero, Minh Quoc Tran +1 more |
2007-01-30 |
$15,947,000 |
| 7157335 |
Using thin undoped TEOS with BPTEOS ILD or BPTEOS ILD alone to improve charge loss and contact resistance in multi bit memory devices |
Ning Cheng, Minh Van Ngo, Hirokazu Tokuno, Angela T. Hui, Yi He +3 more |
2007-01-02 |
|
| 7038320 |
Single damascene integration scheme for preventing copper contamination of dielectric layer |
Fei Wang, Minh Van Ngo |
2006-05-02 |
$21,137,000 |
| 7033960 |
Multi-chamber deposition of silicon oxynitride film for patterning |
Richard J. Huang, Pei-Yuan Gao |
2006-04-25 |
$9,950,000 |
| 7001840 |
Interconnect with multiple layers of conductive material with grain boundary between the layers |
Minh Quoc Tran, Fei Wang, Lynne A. Okada |
2006-02-21 |
$12,668,000 |
| 6992004 |
Implanted barrier layer to improve line reliability and method of forming same |
Paul R. Besser, Matthew S. Buynoski, Minh Quoc Tran, Pin-Chin Connie Wang, Sergey Lopatin +1 more |
2006-01-31 |
$15,487,000 |
| 6939793 |
Dual damascene integration scheme for preventing copper contamination of dielectric layer |
Fei Wang, Christy Mei-Chu Woo |
2005-09-06 |
$13,866,000 |
| 6900002 |
Antireflective bi-layer hardmask including a densified amorphous carbon layer |
Marina V. Plat, Marilyn I. Wright, Scott A. Bell |
2005-05-31 |
$6,268,000 |
| 6893967 |
L-shaped spacer incorporating or patterned using amorphous carbon or CVD organic materials |
Marilyn I. Wright, Douglas J. Bonser, Kay Hellig |
2005-05-17 |
$3,810,000 |
| 6875664 |
Formation of amorphous carbon ARC stack having graded transition between amorphous carbon and ARC material |
Richard J. Huang, Srikanteswara Dakshina-Murthy, Philip A. Fisher, Cyrus E. Tabery |
2005-04-05 |
$7,987,000 |
| 6864556 |
CVD organic polymer film for advanced gate patterning |
Marina V. Plat, Chih-Yuh Yang, Scott A. Bell, Richard J. Huang, Christopher F. Lyons +2 more |
2005-03-08 |
$6,020,000 |
| 6803313 |
Method for forming a hardmask employing multiple independently formed layers of a pecvd material to reduce pinholes |
Pei-Yuan Gao, Richard J. Huang |
2004-10-12 |
$4,245,000 |
