Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7169706 | Method of using an adhesion precursor layer for chemical vapor deposition (CVD) copper deposition | Sergey Lopatin, Paul R. Besser, Jeremias D. Romero, Minh Quoc Tran, Lu You +1 more | 2007-01-30 |
| 6791081 | Method for determining pore characteristics in porous materials | Robert M. Ulfig, Suzette K. Pangrle, Jeremias D. Romero | 2004-09-14 |
| 6703308 | Method of inserting alloy elements to reduce copper diffusion and bulk diffusion | Paul R. Besser, Matthew S. Buynoski, Sergey Lopatin, Phin-Chin Connie Wang | 2004-03-09 |
| 6500754 | Anneal hillock suppression method in integrated circuit interconnects | Darrell M. Erb, Steven C. Avanzino | 2002-12-31 |