Issued Patents All Time
Showing 25 most recent of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10490719 | Die bond pad design to enable different electrical configurations | Wen-Lang Yu, Oleg Borisovich Shchekin, Franklin J. Wall, Jr., Kuochou Tai, Mohiuddin Mala +2 more | 2019-11-26 |
| 10170675 | P—N separation metal fill for flip chip LEDs | Jipu Lei, Yajun Wei, Stefano Schiaffino, Daniel A. Steigerwald | 2019-01-01 |
| 10020431 | Sealed semiconductor light emitting device | Jipu Lei, Stefano Schiaffino | 2018-07-10 |
| 9935069 | Reducing solder pad topology differences by planarization | Jipu Lei, Stefano Schiaffino, Mooi Guan Ng, Salman Akram | 2018-04-03 |
| 9722161 | P-n separation metal fill for flip chip LEDs | Jipu Lei, Yajun Wei, Stefano Schiaffino, Daniel A. Steigerwald | 2017-08-01 |
| 9608016 | Method of separating a wafer of semiconductor devices | Jipu Lei, Stefano Schiaffino, Grigoriy Basin | 2017-03-28 |
| 9484513 | Semiconductor light emitting device with thick metal layers | Stefano Schiaffino, Jipu Lei | 2016-11-01 |
| 9425325 | Electrically programmable and eraseable memory device | Minh Quoc Tran, Minh Van Ngo, Jeong-Uk Huh | 2016-08-23 |
| 9406857 | Chip scale light emitting device with metal pillars in a molding compound formed at wafer level | Jipu Lei, Stefano Schiaffino, Mooi Guan Ng, Grigoriy Basin, Salman Akram | 2016-08-02 |
| 9324927 | Semiconductor light emitting device with thick metal layers | Stefano Schiaffino, Jipu Lei | 2016-04-26 |
| 9219209 | P-N separation metal fill for flip chip LEDs | Jipu Lei, Yajun Wei, Stefano Schiafino, Daniel A. Steigerwald | 2015-12-22 |
| 8735960 | High ultraviolet light absorbance silicon oxynitride film for improved flash memory device performance | Minh Quoc Tran, Minh Van Ngo, Sung Jin Kim, Simon S. Chan, Ning Cheng | 2014-05-27 |
| 8633074 | Electrically programmable and erasable memory device and method of fabrication thereof | Minh Quoc Tran, Minh Van Ngo, Jeong-Uk Huh | 2014-01-21 |
| 8415256 | Gap-filling with uniform properties | Lu You, Hirokazu Tokuno, Minh Quoc Tran, Minh Van Ngo, Hieu Pham +2 more | 2013-04-09 |
| 8384146 | Methods for forming a memory cell having a top oxide spacer | Shenqing Fang, Angela T. Hui, Gang Xue, Kashmir Sahota, Scott A. Bell +2 more | 2013-02-26 |
| 8309455 | SiH4 soak for low hydrogen SiN deposition to improve flash memory device performance | Sung Jin Kim, Minh Van Ngo, Hieu Pham, Masato Tsuboi, Shinich Imada | 2012-11-13 |
| 8202810 | Low-H plasma treatment with N2 anneal for electronic memory devices | Allen L. Evans, Minh Quoc Tran, Lu You, Minh Van Ngo, Pei-Yuan Gao +4 more | 2012-06-19 |
| 8202779 | Methods for forming a memory cell having a top oxide spacer | Shenqing Fang, Angela T. Hui, Gang Xue, Kashmir Sahota, Scott A. Bell +2 more | 2012-06-19 |
| 8035153 | Self-aligned patterning method by using non-conformal film and etch for flash memory and other semiconductor applications | Shenqing Fang, Jihwan P. Choi, Calvin T. Gabriel, Fei Wang, Angela T. Hui +4 more | 2011-10-11 |
| 8026169 | Cu annealing for improved data retention in flash memory devices | Lu You, Minh Quoc Tran, Minh Van Ngo, Hieu Pham, Erik Wilson +4 more | 2011-09-27 |
| 8017870 | Fastening device for a line | Keiji Kawakami | 2011-09-13 |
| 7985674 | SiH4 soak for low hydrogen SiN deposition to improve flash memory device performance | Sung Jin Kim, Minh Van Ngo, Hieu Pham, Masato Tsuboi, Shinich Imada | 2011-07-26 |
| 7884030 | Gap-filling with uniform properties | Lu You, Hirokazu Tokuno, Minh Quoc Tran, Minh Van Ngo, Hieu Pham +2 more | 2011-02-08 |
| 7776682 | Ordered porosity to direct memory element formation | Suzette K. Pangrle, Steven C. Avanzino, Jeffrey A. Shields, Fei Wang, Minh Quoc Tran +2 more | 2010-08-17 |
| 7732276 | Self-aligned patterning method by using non-conformal film and etch back for flash memory and other semiconductor applications | Shenqing Fang, Jihwan P. Choi, Calvin T. Gabriel, Fei Wang, Angela T. Hui +4 more | 2010-06-08 |