Issued Patents All Time
Showing 1–25 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11779925 | System, method, and device for forming an array of emulsions | Thomas H. Cauley, III, John M. Dzenitis, Steve Hobbs | 2023-10-10 |
| 11207685 | System, method, and device for forming an array of emulsions | Thomas H. Cauley, III, John M. Dzenitis, Steve Hobbs | 2021-12-28 |
| 10682647 | Microfluidic system with fluid pickups | Anthony Makarewicz, Luc Bousse | 2020-06-16 |
| 10170675 | P—N separation metal fill for flip chip LEDs | Jipu Lei, Yajun Wei, Alexander H. Nickel, Daniel A. Steigerwald | 2019-01-01 |
| 10020431 | Sealed semiconductor light emitting device | Jipu Lei, Alexander H. Nickel | 2018-07-10 |
| 9935069 | Reducing solder pad topology differences by planarization | Jipu Lei, Alexander H. Nickel, Mooi Guan Ng, Salman Akram | 2018-04-03 |
| 9722137 | LED having vertical contacts redistributed for flip chip mounting | Jipu Lei, Kwong-Hin Henry Choy, Yajun Wei, Daniel A. Steigerwald | 2017-08-01 |
| 9722161 | P-n separation metal fill for flip chip LEDs | Jipu Lei, Yajun Wei, Alexander H. Nickel, Daniel A. Steigerwald | 2017-08-01 |
| 9687848 | Microfluidic system with fluid pickups | Anthony Makarewicz, Luc Bousse | 2017-06-27 |
| 9660164 | Light emitting device with reduced epi stress | Frederic Stephane Diana, Yajun Wei, Brendan Jude Moran | 2017-05-23 |
| 9608016 | Method of separating a wafer of semiconductor devices | Jipu Lei, Alexander H. Nickel, Grigoriy Basin | 2017-03-28 |
| 9484513 | Semiconductor light emitting device with thick metal layers | Alexander H. Nickel, Jipu Lei | 2016-11-01 |
| 9409174 | Microfluidic system with fluid pickups | Anthony Makarewicz, Luc Bousse | 2016-08-09 |
| 9406857 | Chip scale light emitting device with metal pillars in a molding compound formed at wafer level | Jipu Lei, Alexander H. Nickel, Mooi Guan Ng, Grigoriy Basin, Salman Akram | 2016-08-02 |
| 9324927 | Semiconductor light emitting device with thick metal layers | Alexander H. Nickel, Jipu Lei | 2016-04-26 |
| 9246061 | LED having vertical contacts redistruted for flip chip mounting | Jipu Lei, Kwong-Hin Henry Choy, Yajun Wei, Danel Alexander Steigerwald | 2016-01-26 |
| 9093630 | Light emitting device with reduced EPI stress | Frederic Stephane Diana, Yajun Wei, Brendan Jude Moran | 2015-07-28 |
| 9076944 | Method of bonding a semiconductor device using a compliant bonding structure | James G. Neff, John E. Epler | 2015-07-07 |
| 8384118 | LED assembly having maximum metal support for laser lift-off of growth substrate | Daniel A. Steigerwald, Mari Holcomb, Grigoriy Basin, Paul Scott Martin, John E. Epler | 2013-02-26 |
| 8202741 | Method of bonding a semiconductor device using a compliant bonding structure | James G. Neff, John E. Epler | 2012-06-19 |
| 8053905 | Compliant bonding structures for semiconductor devices | John E. Epler, Michael R. Krames, James G. Neff | 2011-11-08 |
| 7977132 | Extension of contact pads to the die edge via electrical isolation | Tal Margalith, Henry Kwong-Hin Choy | 2011-07-12 |
| 7842963 | Electrical contacts for a semiconductor light emitting apparatus | John Uebbing | 2010-11-30 |
| 7736945 | LED assembly having maximum metal support for laser lift-off of growth substrate | Daniel A. Steigerwald, Mari Holcomb, Grigoriy Basin, Paul Scott Martin, John E. Epler | 2010-06-15 |
| 7439449 | Flexible circuit for establishing electrical connectivity with optical subassembly | Dev Kumar, Giorgio Giaretta, Donald A. Ice | 2008-10-21 |