Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11411137 | III-nitride light emitting diodes with tunnel junctions wafer bonded to a conductive oxide and having optically pumped layers | Asad J. Mughal, Stacy J. Kowsz, Robert M. Farrell, Benjamin P. Yonkee, Erin C. Young +4 more | 2022-08-09 |
| 11217722 | Hybrid growth method for III-nitride tunnel junction devices | Erin C. Young, Benjamin P. Yonkee, John T. Leonard, James S. Speck, Steven P. DenBaars +1 more | 2022-01-04 |
| 10685835 | III-nitride tunnel junction with modified P-N interface | Benjamin P. Yonkee, Erin C. Young, John T. Leonard, James S. Speck, Steven P. DenBaars +1 more | 2020-06-16 |
| 8911518 | Method and system for dicing substrates containing gallium and nitrogen material with conductive core via structures | Arpan Chakraborty, Michael R. Krames, Rafael Aldaz | 2014-12-16 |
| 8450754 | Series connected flip chip LEDs with growth substrate removed | Michael R. Krames, John E. Epler, Daniel A. Steigerwald | 2013-05-28 |
| 8188458 | Non-polar (Al,B,In,Ga)N quantum well and heterostructure materials and devices | Michael D. Craven, Stacia Keller, Steven P. DenBaars, James S. Speck, Shuji Nakamura +1 more | 2012-05-29 |
| 8062916 | Series connected flip chip LEDs with growth substrate removed | Michael R. Krames, John E. Epler, Daniel A. Steigerwald | 2011-11-22 |
| 7982208 | Non-polar (Al,B,In,Ga)N quantum well and heterostructure materials and devices | Michael D. Craven, Stacia Keller, Steven P. DenBaars, James S. Speck, Shuji Nakamura +1 more | 2011-07-19 |
| 7977132 | Extension of contact pads to the die edge via electrical isolation | Stefano Schiaffino, Henry Kwong-Hin Choy | 2011-07-12 |
| 7091514 | Non-polar (Al,B,In,Ga)N quantum well and heterostructure materials and devices | Michael D. Craven, Stacia Keller, Steven P. DenBaars, James S. Speck, Shuji Nakamura +1 more | 2006-08-15 |