| 10170675 |
P—N separation metal fill for flip chip LEDs |
Jipu Lei, Yajun Wei, Alexander H. Nickel, Stefano Schiaffino |
2019-01-01 |
|
| 10056531 |
Method of processing a semiconductor structure |
Jerome Chandra Bhat, Michael D. Camras, Han Ho Choi, Nathan Gardner, Oleg Borisovich Shchekin |
2018-08-21 |
|
| 9722137 |
LED having vertical contacts redistributed for flip chip mounting |
Jipu Lei, Kwong-Hin Henry Choy, Yajun Wei, Stefano Schiaffino |
2017-08-01 |
$624,000 |
| 9722161 |
P-n separation metal fill for flip chip LEDs |
Jipu Lei, Yajun Wei, Alexander H. Nickel, Stefano Schiaffino |
2017-08-01 |
$624,000 |
| 9705047 |
Method of attaching a light emitting device to a support substrate |
Jerome Chandra Bhat, Salman Akram |
2017-07-11 |
$1,293,000 |
| 9431581 |
Method of attaching a light emitting device to a support substrate |
Jerome Chandra Bhat, Salman Akram |
2016-08-30 |
$454,000 |
| 9219209 |
P-N separation metal fill for flip chip LEDs |
Jipu Lei, Yajun Wei, Alexander H. Nickel, Stefano Schiafino |
2015-12-22 |
$414,000 |
| 9153758 |
Method of attaching a light emitting device to a support substrate |
Jerome Chandra Bhat, Salman Akram |
2015-10-06 |
$630,000 |
| 8951817 |
Light emitting device chip scale package |
— |
2015-02-10 |
$1,791,000 |
| 7652304 |
Contacting scheme for large and small area semiconductor light emitting flip chip devices |
Jerome Chandra Bhat, Michael J. Ludowise |
2010-01-26 |
|
| 7351599 |
High-powered light emitting device with improved thermal properties |
Yu-Chen Shen, Paul Scott Martin |
2008-04-01 |
|
| 7348212 |
Interconnects for semiconductor light emitting devices |
Stefano Schiaffino, Ashim Shatil Haque, Paul Scott Martin, Decai Sun |
2008-03-25 |
|
| 7345323 |
Formation of Ohmic contacts in III-nitride light emitting devices |
Changhua Chen, Michael D. Camras, Gina L. Christenson, R. Scott Kern, Chihping Kuo +2 more |
2008-03-18 |
|
| 7095061 |
Contacting scheme for large and small area semiconductor light emitting flip chip devices |
Jerome Chandra Bhat, Michael J. Ludowise |
2006-08-22 |
|
| 7048412 |
Axial LED source |
Paul Scott Martin, R. Scott West |
2006-05-23 |
$8,360,000 |
| 7015054 |
Semiconductor light emitting device and method |
Michael R. Krames |
2006-03-21 |
$12,832,000 |
| 6977396 |
High-powered light emitting device with improved thermal properties |
Yu-Chen Shen, Paul Scott Martin |
2005-12-20 |
$10,317,000 |
| 6969946 |
Enhanced brightness light emitting device spot emitter |
Frank M. Steranka, Matthijs Keuper |
2005-11-29 |
$12,897,000 |
| 6946309 |
III-Phosphide and III-Arsenide flip chip light-emitting devices |
Michael D. Camras, Frank M. Steranka, Michael J. Ludowise, Paul Scott Martin, Michael R. Krames +2 more |
2005-09-20 |
$6,589,000 |
| 6946685 |
Light emitting semiconductor method and device |
Michael J. Ludowise, Steven A. Maranowski, Serge L. Rudaz, Jerome Chandra Bhat |
2005-09-20 |
$6,589,000 |
| 6933535 |
Light emitting devices with enhanced luminous efficiency |
William D. COLLINS III, Robert M. Fletcher, Michael J. Ludowise, Jason Posselt |
2005-08-23 |
$6,968,000 |
| 6914272 |
Formation of Ohmic contacts in III-nitride light emitting devices |
Werner Goetz, Michael D. Camras, Changhua Chen, Gina L. Christenson, R. Scott Kern +2 more |
2005-07-05 |
$5,173,000 |
| 6891197 |
Semiconductor LED flip-chip with dielectric coating on the mesa |
Jerome Chandra Bhat, Michael J. Ludowise |
2005-05-10 |
$6,788,000 |
| 6885035 |
Multi-chip semiconductor LED assembly |
Jerome Chandra Bhat, Reena Khare |
2005-04-26 |
$9,375,000 |
| 6844571 |
III-nitride light-emitting device with increased light generating capability |
Michael R. Krames, Fred A. Kish, Jr., Pradeep Rajkomar, Jonathan J. Wierer, Jr., Tun Tan |
2005-01-18 |
$10,829,000 |
