Issued Patents All Time
Showing 1–25 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148868 | Light emitting diode constructions and methods for making the same | Vladimir Odnoblyudov | 2024-11-19 |
| 11411152 | Packaging photon building blocks with top side connections and interconnect structure | — | 2022-08-09 |
| 11245058 | Light emitting diode constructions and methods for making the same | Vladimir Odnoblyudov | 2022-02-08 |
| 10840424 | Packaging photon building blocks with top side connections and interconnect structure | — | 2020-11-17 |
| 10347807 | Packaging photon building blocks with top side connections and interconnect structure | — | 2019-07-09 |
| 10325890 | Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate | Tao Tong, Mike Kwon, Michael Solomensky | 2019-06-18 |
| 10297731 | Light emitting diode constructions and methods for making the same | Vladimir Odnoblyudov | 2019-05-21 |
| 9985004 | Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate | Tao Tong, Mike Kwon, Michael Solomensky | 2018-05-29 |
| 9893039 | Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate | Tao Tong, Mike Kwon, Michael Solomensky | 2018-02-13 |
| 9893243 | LED-based light source utilizing asymmetric conductors | Yan Chai | 2018-02-13 |
| 9653437 | Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate | Tao Tong, Mike Kwon, Michael Solomensky | 2017-05-16 |
| 9595645 | LED lens design with more uniform color-over-angle emission | Tao Tong, Wenhui Zhang | 2017-03-14 |
| 9478719 | LED-based light source utilizing asymmetric conductors | Yan Chai | 2016-10-25 |
| 9468052 | LED array member and integrated control module assembly having active circuitry | Michael Neal Gershowitz, Babak Imangholi | 2016-10-11 |
| 9461023 | Jetting a highly reflective layer onto an LED assembly | — | 2016-10-04 |
| 9439299 | Low-profile outdoor lighting module with light emitting diodes | Robert Tudhope | 2016-09-06 |
| 9312465 | Packaging photon building blocks having only top side connections in a molded interconnect structure | Tao Tong, Mike Kwon, Michael Solomensky | 2016-04-12 |
| 9276177 | LED lens design with more uniform color-over-angle emission | Tao Tong, Wenhui Zhang | 2016-03-01 |
| 9247594 | LED array member and thermally decoupled integrated control module assembly | Michael Neal Gershowitz, Babak Imangholi | 2016-01-26 |
| 9164001 | Using an LED die to measure temperature inside silicone that encapsulates an LED array | Babak Imangholi, Michael Neal Gershowitz | 2015-10-20 |
| 9155145 | LED array member and integrated control module assembly having active circuitry | Michael Neal Gershowitz, Babak Imangholi | 2015-10-06 |
| 9130139 | Packaging photon building blocks having only top side connections in a molded interconnect structure | Tao Tong, Mike Kwon | 2015-09-08 |
| 9065024 | LED lens design with more uniform color-over-angle emission | Tao Tong, Wenhui Zhang | 2015-06-23 |
| 8941129 | Using an LED die to measure temperature inside silicone that encapsulates an LED array | Michael Neal Gershowitz, Babak Imangholi | 2015-01-27 |
| 8803180 | Micro-bead blasting process for removing a silicone flash layer | Tao Tong, Mike Kwon | 2014-08-12 |