| 10325890 |
Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate |
R. Scott West, Tao Tong, Mike Kwon |
2019-06-18 |
| 9985004 |
Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate |
R. Scott West, Tao Tong, Mike Kwon |
2018-05-29 |
| 9893039 |
Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate |
R. Scott West, Tao Tong, Mike Kwon |
2018-02-13 |
| 9653437 |
Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate |
R. Scott West, Tao Tong, Mike Kwon |
2017-05-16 |
| 9331056 |
White LED assembly with LED string and intermediate node substrate terminals |
Tao Xu |
2016-05-03 |
| 9312465 |
Packaging photon building blocks having only top side connections in a molded interconnect structure |
R. Scott West, Tao Tong, Mike Kwon |
2016-04-12 |
| 9252336 |
Multi-cup LED assembly |
Wei Shi, Alex Shaikevitch, Shanquan Bao |
2016-02-02 |
| 9012932 |
White LED assembly with LED string and intermediate node substrate terminals |
Tao Xu |
2015-04-21 |
| 8759847 |
White LED assembly with LED string and intermediate node substrate terminals |
Tao Xu |
2014-06-24 |
| 8652860 |
Packaging photon building blocks having only top side connections in a molded interconnect structure |
R. Scott West, Tao Tong, Mike Kwon |
2014-02-18 |
| 8506754 |
Cross flow CVD reactor |
Vahid S. Moshtagh, Heng Liu, Jeffery Ramer |
2013-08-13 |
| 7887384 |
Transparent ring LED assembly |
Alex Shaikevitch, Shanquan Bao |
2011-02-15 |