Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10170675 | P—N separation metal fill for flip chip LEDs | Yajun Wei, Alexander H. Nickel, Stefano Schiaffino, Daniel A. Steigerwald | 2019-01-01 |
| 10020431 | Sealed semiconductor light emitting device | Stefano Schiaffino, Alexander H. Nickel | 2018-07-10 |
| 9935069 | Reducing solder pad topology differences by planarization | Stefano Schiaffino, Alexander H. Nickel, Mooi Guan Ng, Salman Akram | 2018-04-03 |
| 9722137 | LED having vertical contacts redistributed for flip chip mounting | Kwong-Hin Henry Choy, Yajun Wei, Stefano Schiaffino, Daniel A. Steigerwald | 2017-08-01 |
| 9722161 | P-n separation metal fill for flip chip LEDs | Yajun Wei, Alexander H. Nickel, Stefano Schiaffino, Daniel A. Steigerwald | 2017-08-01 |
| 9608016 | Method of separating a wafer of semiconductor devices | Alexander H. Nickel, Stefano Schiaffino, Grigoriy Basin | 2017-03-28 |
| 9484513 | Semiconductor light emitting device with thick metal layers | Stefano Schiaffino, Alexander H. Nickel | 2016-11-01 |
| 9406857 | Chip scale light emitting device with metal pillars in a molding compound formed at wafer level | Stefano Schiaffino, Alexander H. Nickel, Mooi Guan Ng, Grigoriy Basin, Salman Akram | 2016-08-02 |
| 9324927 | Semiconductor light emitting device with thick metal layers | Stefano Schiaffino, Alexander H. Nickel | 2016-04-26 |
| 9246061 | LED having vertical contacts redistruted for flip chip mounting | Kwong-Hin Henry Choy, Yajun Wei, Stefano Schiaffino, Danel Alexander Steigerwald | 2016-01-26 |
| 9219209 | P-N separation metal fill for flip chip LEDs | Yajun Wei, Alexander H. Nickel, Stefano Schiafino, Daniel A. Steigerwald | 2015-12-22 |
| 7534967 | Conductor structures including penetrable materials | Jeffry Kelber, Noel P. Magtoto, Sergei Rudenja | 2009-05-19 |